ATS-15H-79-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	26.55°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction:

Heat sinks are components used in electronics to dissipate heat generated by power supply circuits or other components. The ATS-15H-79-C3-R0 is a thermal heat sink specifically designed for industrial usage and computers. In this article, we will discuss the application fields of the ATS-15H-79-C3-R0 and its working principle.

Meant to Function as a Heat Sink:

Heat sinks move heat from a hot source, such as a power supply or processor, to a cooler environment. The ATS-15H-79-C3-R0 is designed to function as a heat sink in order to reduce the surface temperature of these components. It is meant to be used with high-powered electronic components, as it has a higher surface temperature rating than many other heat sinks. This allows it to dissipate more heat and keep the device temperature down.

Unique Design Offers Optimal Performance:

The design of the ATS-15H-79-C3-R0 is unique from other thermal heat sinks. It is comprised of an aluminum base that is machined to a precise tolerance. This base can be mounted easily for optimal thermal performance. It also features finned aluminum pins that are spaced apart to maximize air flow and convection for better thermal transfer. The combination of the base and pins creates a large heat mass that is able to quickly absorb and dissipate heat.

Ideal for Various Applications:

The ATS-15H-79-C3-R0 is an excellent choice for industrial applications that require high levels of thermal performance. It can be used in a variety of settings, including factory automation, medical equipment, and computer equipment. It also can be used for cooling power supplies and other components in a variety of types of computers. Additionally, the heat sink is well suited for use in consumer electronics such as 3D printers and other devices that require thermal solutions.

Working Principle:

The ATS-15H-79-C3-R0 works by absorbing the heat generated by a component or device, and then dissipating the heat away from the component or device using the aluminum base and fins. The aluminum fins of the heat sink are spaced apart to allow for optimal airflow and convection, as air is able to flow freely over the fins. Heat is then transferred from the fins, to the aluminum base, and then finally passed through into the environment.

Conclusion:

The ATS-15H-79-C3-R0 is an ideal solution for applications in need of thermal performance. It has an optimal design that allows it to efficiently absorb and dissipate heat while maintaining a low profile. The heat sink is well suited for industrial applications, consumer electronics, and computer equipment. The aluminum base and fins of the ATS-15H-79-C3-R0 work together to transfer heat away from a component to the ambient air, making it a great way to keep a device cool.

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