| Allicdata Part #: | ATS-15H-80-C1-R0-ND |
| Manufacturer Part#: |
ATS-15H-80-C1-R0 |
| Price: | $ 3.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-15H-80-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.94840 |
| 30 +: | $ 2.86860 |
| 50 +: | $ 2.70925 |
| 100 +: | $ 2.54986 |
| 250 +: | $ 2.39047 |
| 500 +: | $ 2.31079 |
| 1000 +: | $ 2.07174 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are the integral components of electronic devices that dissipate the tremendous heat generated by the circuit’s operation. In the present day, with the advancement of science and technology, it has become essential to manufacture efficient and effective thermal management solutions to keep the regular running of the device and also improve its efficiency. The ATS-15H-80-C1-R0 heat sink is one such effective solution which is able to deal with the massive amount of heat generated by the circuit.
This heat sink is unique in its design and functionality and is able to ensure the best thermal performance. It is composed of a high-performance fin-array and shaped into a unique ‘C’ profile that offers unparalleled heat dissipation. The profiles are designed to give maximum contact surface area for ideal thermal transfer and heat dissipation capacity. The square mounting holes ensure perfect mounting onto the printed circuit board. The fins are evenly spaced, and the overall design provides excellent airflow for efficient heat exchange.
In addition to the effective thermal-conducting design, the ATS-15H-80-C1-R0 also incorporates an additional heat pipe, which helps to provide additional heat dissipating benefits. The heat pipe exchanges heat energy between the source and the sink of the circuit, thus allowing for improved thermal efficiency. The heat pipes consist of two parts: the evaporator and the condenser. The evaporator absorbs heat energy from the source, which is then transferred to the sink via the condenser. With the enhanced thermal conductivity and design, this heat sink is able to provide assured heat-dissipation for the circuit, making it one of the most reliable thermal management solutions.
The ATS-15H-80-C1-R0 heat sink is suitable for many applications. It is most commonly used in computers, laptops, and embedded systems, as they are subjected to intensive loads and require substantial thermal management to keep the functionality of the device optimal. The high performance of this heat sink ensures reliable and efficient operation, making it a viable option for all sorts of cooling system applications. The size and flexibility of this thermal-management solution also make it suitable for other kinds of electronic devices, such as audio systems, medical equipment, and navigation systems.
The ATS-15H-80-C1-R0 heat sink is a top-notch cooling solution with excellent thermal performance characteristics. This heat sink is able to provide improved cooling and thermal flexibility to the device in which it is installed, making it ideal for a variety of applications. The remarkable heat transfer efficiency of the ATS-15H-80-C1-R0 makes it an excellent choice for those who are looking for reliable and effective thermal management solutions.
The specific data is subject to PDF, and the above content is for reference