ATS-16A-115-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-16A-115-C1-R0-ND

Manufacturer Part#:

ATS-16A-115-C1-R0

Price: $ 3.23
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X20MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-16A-115-C1-R0 datasheetATS-16A-115-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.93643
30 +: $ 2.85705
50 +: $ 2.69829
100 +: $ 2.53953
250 +: $ 2.38085
500 +: $ 2.30148
1000 +: $ 2.06339
Stock 1000Can Ship Immediately
$ 3.23
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 5.31°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal management is an important part of good engineering. Heat sinks, often used to disperse the heat generated by components, are among the most common methods. The ATS-16A-115-C1-R0 is processor for this type of applications. This product boasts a wide range of features and benefits that make it an option for numerous industrial applications.

ATS-16A-115-C1-R0 Overview

The ATS-16A-115-C1-R0 is a highly advanced, single-stage aluminum heat sink. It is designed to dissipate thermal energy generated by the component while maintaining optimal system performance. This heat sink measures 7.70 x 5.25 x 4.02\'\' and is made from a rugged aluminum alloy to be resistant to corrosion and weathering. Additionally, it features a sturdy, die-cast mounting plate with 3 mounting holes for secure installation.

The ATS-16A-115-C1-R0 processor features a high-efficiency, multi-fin design for improved thermal conductivity. This multi-fin design increases the surface area over which heat is dispersed, making it more efficient at heat dissipation. Furthermore, the processor features a-bonded white silicone interface for improved heat transfer, and its fin height is adjustable in increments as small as 0.2 mm for precise control.

Application

The ATS-16A-115-C1-R0 processor is designed for a variety of industrial applications. Its high-efficiency design and rugged construction make it suitable for extreme conditions and demanding industrial environments. Heat dissipation from components is just one of the many uses for the processor; other common uses include thermal management for motors, transformers, and industrial instruments.

Working Principle

The ATS-16A-115-C1-R0 processor relies on conduction to disperse heat energy. This process works by transferring thermal energy from a hotter source to a cooler sink. Heat is conducted away from the component via the mounting plate and dissipated through the aluminum alloy fins. This disperses the heat away from its source, allowing for the component to remain cool and operating efficiently.

The ATS-16A-115-C1-R0 processor also relies on convection to disperse additional heat energy. Convection works by transferring heat energy through the movement of air and other fluids. The processor utilizes its multi-fin design to increase the surface area and air flow, which helps to disperse the heat energy faster. This combination of conduction and convection ensures that the processor is able to quickly and efficiently disperse thermal energy, allowing the component to maintain optimal performance.

Conclusion

The ATS-16A-115-C1-R0 processor is a single-stage aluminum heat sink designed for thermal management applications. It features a rugged construction, adjustable fin height, and a high-efficiency multi-fin design to ensure efficient thermal energy dissipation. The ATS-16A-115-C1-R0 processor is suitable for a wide range of industrial applications, and its conduction and convection-based design ensures optimal thermal energy dissipation.

The specific data is subject to PDF, and the above content is for reference

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