| Allicdata Part #: | ATS-16A-117-C3-R0-ND |
| Manufacturer Part#: |
ATS-16A-117-C3-R0 |
| Price: | $ 3.49 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16A-117-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.17394 |
| 30 +: | $ 3.08826 |
| 50 +: | $ 2.91677 |
| 100 +: | $ 2.74516 |
| 250 +: | $ 2.57363 |
| 500 +: | $ 2.48783 |
| 1000 +: | $ 2.23047 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.58°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A thermal heat sink, or simply a heat sink, is a device designed to dissipate heat away from an electronic component or system. Heat sinks are typically made from materials with good thermal conductivity and feature fins or plates which facilitate airflow to increase the rate at which they dissipate heat. Proper heat sink placement is important to ensure that the heat that the heat sink is dissipating is being removed from the system, and not heat that is being produced from another component.
The ATS-16A-117-C3-R0 is a thermal heat sink from Paseco Industries. It is designed to dissipate heat away from a variety of components, such as CPUs, GPUs, hard drives, and other components that produce a lot of heat. The ATS-16A-117-C3-R0 works through thermal conduction, using a large metal plate to absorb and dissipate heat away from components. The metal plate has a series of fins which are intended to increase the surface area of the plate, increasing the heat dissipation rate.
The ATS-16A-117-C3-R0 was designed with a variety of application fields in mind. It is ideal for use in gaming systems, computers, servers, and other systems with components that generate a lot of heat. It is also suitable for use in industrial applications, such as robotics and automation. Additionally, the ATS-16A-117-C3-R0 has been tested to ensure that it can withstand extreme temperatures and pressures, making it suitable for use in high-performance applications.
The ATS-16A-117-C3-R0 is designed to provide an efficient and cost-effective way to dissipate heat from components in a wide variety of applications. Its thermal conductivity helps to ensure that it will quickly and effectively remove heat from components, reducing the risk of component damage due to overheating. The fins on the metal plate also help to improve the cooling performance of the heat sink, as they increase the surface area available for heat dissipation. This helps to ensure that the ATS-16A-117-C3-R0 is able to quickly and effectively dissipate heat away from components.
In conclusion, the ATS-16A-117-C3-R0 thermal heat sink is a very effective and affordable way to ensure that components remain cool and functioning properly. Its thermal conductivity and fin design make it highly effective at dissipating heat, and it is suitable for use in a variety of applications where component cooling is critical. The ATS-16A-117-C3-R0 is an essential component when it comes to keeping components cool and functioning optimally.
The specific data is subject to PDF, and the above content is for reference