ATS-16A-26-C1-R0

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal − Heat Sinks

Heat sinks are essential components to dissipate thermal energy from electronic components in order to maintain temperature at an acceptable level. Heat sinks ensure that components in an electronic circuit do not overheat and fail to operate, a condition that can be both damaging and hazardous to itself and the surrounding environment. ATS-16A-26-C1-R0 is a type of specialized heat sinks designed for the purpose of efficient thermal management.

ATS-16A-26-C1-R0 Application Fields

ATS-16A-26-C1-R0 is a high-performance, ultra-compact heat sink primarily used for cooling integrated circuit packages such as system-on-chip (SOC), large-scale integration (LSI) or microprocessor chips. The heat sink cuts down the power dissipated by computer and communication systems’ components, making them more reliable and allowing them to sustain higher thermal loads than conventional heat sinks. It has a great amount of thermal conduction and convection ability. It is viable in applications such as communications, defense, power supplies and industrial control.

ATS-16A-26-C1-R0 Working Principle

Heat sinks are designed such that they dissipate heat due to the convective flow of air surrounding them. Heat is eliminated from the heat-generating component into the metal block by means of conduction, and then the air passing through or around the heat sink picks up the heat and transports it away. ATS-16A-26-C1-R0 has the ability to remain thermally efficient in a very restricted space due to the wave-shape frame. The wave contour and hollow design of the ribs enable air to pass through the heat sink more efficiently, while enlarging contact area between air and the heat sink for enhanced heat removal.

This thermal-dissipation product uses eight-wave design to block directional air flux. The channels created by the wave geometry captures large amounts of air which acts as a cooling agent inside the heat sink. The fins capture the air flows and spread the heat over a larger area while keeping the components cool, thus increasing the thermal conductivity of heat sink. The channels also ensure the uniform air flow so as to reduce temperature, avoid hot spots, and maximize the heat dissipation.

ATS-16A-26-C1-R0 features a design tailored for socket connections with moderately large or ultrathin chips. The base and the integrated channels maximize the surface area contact between the chips and the heat sink, and the integrated metal pressure sensitive adhesive (PSA) tape beneath the foot of the heat sink make sure that the heat sink firmly attaches to the PCB. In addition, its rounded edges and thin profile ensure a tight fit when placed in limited space, and its lightweight feature also adds to its versatility.

To conclude, ATS-16A-26-C1-R0 is a versatile and space-saving type of heat sink designed for efficient thermal management of circuit components in communication, defense, industrial control, and power supply applications. This heat sink is easy to install and fits snugly into small spaces. It features a wave pattern design which maximizes air flow and the contact area between chips and heat sink, reducing temperature and avoiding hot spots. Its integrated pressure-sensitive adhesive also helps ensure secure and reliable thermal management of the devices.

The specific data is subject to PDF, and the above content is for reference