ATS-16A-28-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.756" (70.00mm)
Width:	2.756" (70.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.57°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction

ATS-16A-28-C1-R0 is a type of thermal-heat sinks that is designed to dissipate and remove heat from electronic and electrical components. It is a larger-sized thermal-heat sink and supports better heat conduction, making it most suitable for applications that require higher thermal performance. This article will discuss about the application fields and working principle of ATS-16A-28-C1-R0.

Applications

ATS-16A-28-C1-R0 is a versatile thermal-heat sink, which can be used for various applications such as cooling of high density power electronics, LED lighting products, and IGBTs. Moreover, this high performance thermal-heat sink is also suitable for applications such as server and communication systems, household appliances, and other electronic appliances that generate high thermal load. Furthermore, this heat sink can also be used for cooling devices such as motors, transformers, and compressors.

Working Principle

The working principle of ATS-16A-28-C1-R0 is based on convection-based heat dissipation. This thermal-heat sink is equipped with a series of fins that are designed to provide maximum area for radiating heat away from the component in order to help reduce its operating temperature. The purpose of this heat sink is to absorb the heat from the component, then dissipate it through the fins to the surrounding air. The heat is then transferred via the fins and external metal layers and dissipated away from the component. Additionally, the heat can also pass through the heat sink body and be dissipated away from the component as well.

This thermal-heat sink also features a highly efficient airflow structure, which allows air to flow freely around the component while providing cooling. This helps to increase thermal efficiency, making it suitable for a range of applications. Furthermore, this type of thermal-heat sink is also designed to meet the exact requirements of its particular application, ensuring that it provides optimal performance and reliability.

Conclusion

ATS-16A-28-C1-R0 is a thermal-heat sink that is ideal for applications that require high thermal performance and reliability. Its application fields range from cooling of high density power electronics, LED lighting products, and IGBTs, to cooling of motors, transformers, and compressors. Furthermore, it is equipped with a highly efficient airflow structure and fins, which help to ensure the best possible heat dissipation. The principles of convection-based heat dissipation help to ensure that the component remains cool even under the toughest conditions.

The specific data is subject to PDF, and the above content is for reference