Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	28.78°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to Thermal - Heat Sinks

Thermal-heat sinks are a vital piece of equipment when it comes to dealing with the temperatures of electronic components. Heat sinks are used in a variety of applications, from computer systems to industrial machinery. As such, it is important to understand the various applications and their associated working principles. In this article, we will be exploring the application field and working principle of ATS-16A-43-C1-R0, an example of a thermal-heat sink.

What is a Thermal-Heat Sink?

Before delving into the application field and working principle of ATS-16A-43-C1-R0, it is important to understand the concept of a thermal-heat sink. A thermal-heat sink is a device that is connected to a component to draw away heat and dissipate it into the environment. This is accomplished by designing the component with high thermal conductivity and large surface area to ensure efficient heat dissipation. The larger the heat sink’s surface area, the better its ability to dissipate heat. Typically, the heat sink is connected to the component via metallic contact. The thermal resistance of the contact and the combined thermal resistance of the heat sink and component combination are important factors to consider during the design process. Heat sinks are usually made from aluminum, copper, or other thermally conductive materials that are lightweight and inexpensive.

Application Field of ATS-16A-43-C1-R0

The ATS-16A-43-C1-R0 heat sink is designed for a wide range of applications. It is most commonly used in telecommunications applications as a high-performance thermal solution for surface mount components. It is also used in automotive, industrial, medical, and consumer electronic applications. The ATS-16A-43-C1-R0 is designed as a low profile solution with a height of 0.45 inches, making it an ideal choice for applications where space is a concern.In addition to this, the ATS-16A-43-C1-R0 is designed for excellent thermal performance. It offers low thermal resistance and efficient heat dissipation. The heat sink is constructed with high thermal conductivity and large surface area to maximize heat dissipation. The heat sink has also been designed to be lightweight and low profile, making it an ideal choice for applications that require a reliable and lightweight thermal solution.

Working Principle of ATS-16A-43-C1-R0

The working principle of ATS-16A-43-C1-R0 can be summarized as follows: heat from the electronic component is drawn away by the heat sink material and dissipated into the environment. This is accomplished through a combination of thermal conductivity and surface area. The large surface area ensures efficient heat dissipation, while the heat-conductive material draws heat away from the electronic component. The ATS-16A-43-C1-R0 is designed to maximize heat dissipation. The combination of high thermal conductivity and large surface area ensures efficient heat dissipation even under the most demanding conditions. Furthermore, the low profile design enables the heat sink to fit into tight spaces and maintain its performance in a variety of applications.

Conclusion

In conclusion, thermal-heat sinks are a vital piece of equipment when it comes to dealing with the temperatures of electronic components. Heat sinks are used in a variety of applications, from computer systems to industrial machinery. As such, it is important to understand the various applications and their associated working principles. ATS-16A-43-C1-R0 is an example of a thermal-heat sink, which is designed for use in a wide range of applications. Its working principle is based on the concept of thermal conductivity and surface area, which ensure efficient heat dissipation. By understanding the application field and working principle of ATS-16A-43-C1-R0, engineers can design systems with reliable and efficient thermal performance.

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