| Allicdata Part #: | ATS26559-ND |
| Manufacturer Part#: |
ATS-16A-60-C2-R0 |
| Price: | $ 4.63 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16A-60-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.20840 |
| 10 +: | $ 4.09437 |
| 25 +: | $ 3.86719 |
| 50 +: | $ 3.63964 |
| 100 +: | $ 3.41221 |
| 250 +: | $ 3.18473 |
| 500 +: | $ 2.95725 |
| 1000 +: | $ 2.90037 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.36°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-16A-60-C2-R0 is a thermal heatsink designed for thermal management of electrical components or devices. It is typically used for mounting, supporting, and dissipating heat from devices that generate heat while operating. The ATS-16A-60-C2-R0 is a high-performance heatsink with a broad range of applications.
The thermal heatsink is designed to improve system reliability by transferring heat away from sensitive components or devices. It is designed to achieve optimal cooling efficiency by offering an optimal balance between aerodynamic performance, air circulation, and surface area. The thermally enhanced aluminum base is designed as a one-piece unit to ensure optimal performance.
The ATS-16A-60-C2-R0 utilizes a highly efficient heat dissipation design as featured by its fin pattern design. The fin pattern is very dense and has a mixed size diameter to maximize the surface area, thus allowing for maximum heat dissipation. Its staggered fin spacing is designed to help in the aerodynamics of airflow, thereby allowing for maximum heat transfer.
The thermal heatsink is designed with an innovative and patented mounting frame and corner that helps secure the heatsink firmly to the component or device. It uses an advanced semi-rigid hinge that enables it to rotate, allowing for precise positioning, fine adjustment, and secure mounting. The device also includes an EMI shield for excellent protection from electromagnetic interference.
An array of optional elements can be added to the ATS-16A-60-C2-R0 for further customization and performance improvements. These elements are designed to provide optimal cooling performance and to further improve the device’s compatibility. Additional elements may include heatspreaders, fan guards, high efficiency fans, thermal coatings, and air deflectors.
The general principle of operation for the ATS-16A-60-C2-R0 is that it uses forced convection to dissipate heat away from the component or device. This is achieved by circulating cool air or liquid around the component or device operating in or near the heatsink. This heat is then transferred away from the component or device to the surroundings and thereby keeping it running properly and efficiently.
In conclusion, the ATS-16A-60-C2-R0 is a highly advanced thermal heatsink designed for thermal management of electrical components and devices. It is designed to provide optimal cooling, EMI shielding, and secure mounting for its applications. Its dense fin pattern and innovative mounting frame and corner enable it to provide maximum heat transfer, while the addition of optional elements further enhances its performance. Its general principle of operation is to use forced convection to dissipate heat from components and devices.
The specific data is subject to PDF, and the above content is for reference