ATS-16A-60-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-16A-60-C3-R0-ND

Manufacturer Part#:

ATS-16A-60-C3-R0

Price: $ 4.40
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X35MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-16A-60-C3-R0 datasheetATS-16A-60-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.95577
30 +: $ 3.73611
50 +: $ 3.51628
100 +: $ 3.29654
250 +: $ 3.07677
500 +: $ 2.85700
1000 +: $ 2.80206
Stock 1000Can Ship Immediately
$ 4.4
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is an important aspect of the performance of any system. In order to ensure the correct operation of electrical systems, coolant or thermal solutions need to be applied to dissipate the heat produced during system operation. One of the solutions for this purpose is the use of heat sinks, which are designed to absorb the heat from electronic components and transfer it to the ambient environment. The ATS-16A-60-C3-R0 is one such type of heat sink, suited to a variety of applications and with an efficient working principle.

The ATS-16A-60-C3-R0 is a compact aluminum fin and base radiative heat sink for efficient heat transfer through a cooling fin assembly. It features a patented fin grooving technology that improves heat dissipation efficiency. The design also provides superior air flow compared to traditional heat sinks, eliminating the need for additional fans or cooling apparatus. Its lightweight construction and low profile make it ideal for applications in tight spaces and with limited clearance.

The ATS-16A-60-C3-R0 is designed to be used with components that generate substantial levels of heat, such as high-power CPUs, which typically require heat sinks to dissipate the internal heat in order to ensure the correct functioning of the hardware device. It is therefore ideal for applications in computer systems, including gaming rigs, data centers, servers, and workstations. In addition, it is also suitable for commercial and industrial applications, such as HVAC, power equipment, and robotics.

The ATS-16A-60-C3-R0 works on the principle of efficient dissipative heat transfer. As hot air rises, heat transfer takes place through the fins of the heat sink. This process creates a convection current, which draws the heat away and cools the component. The fin surface area also provides a large area for efficient cooling, and the thermal conductivity of aluminum also assists in heat transfer.

The ATS-16A-60-C3-R0 also uses a patented dual-layer design, with one layer sculpted into a series of thin grooves that allow air to pass around and through the fins. This ensures that the air can flow freely, increasing heat dissipation by up to 50% compared to traditional heat sinks. The use of multiple layers also allows the fins to absorb more heat and dissipate it more efficiently, leading to improved system performance.

In conclusion, the ATS-16A-60-C3-R0 is a versatile and reliable heat sink that is well-suited for a variety of applications. Its features and patented design make it an efficient thermal solution that is able to dissipate heat quickly and effectively, resulting in improved system performance and reliability. It is therefore an ideal choice for a range of commercial and industrial applications, as well as computer systems.

The specific data is subject to PDF, and the above content is for reference

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