| Allicdata Part #: | ATS-16A-72-C3-R0-ND |
| Manufacturer Part#: |
ATS-16A-72-C3-R0 |
| Price: | $ 5.15 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16A-72-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.63806 |
| 30 +: | $ 4.38060 |
| 50 +: | $ 4.12297 |
| 100 +: | $ 3.86524 |
| 250 +: | $ 3.60755 |
| 500 +: | $ 3.34987 |
| 1000 +: | $ 3.28546 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.19°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks is an unconventional cooling system developed to work in harsh environment. ATS-16A-72-C3-R0 is an advanced thermal heat sink with a 0.6-0.14mm thermoelectric cooling module. It was designed to provide efficient cooling in extreme temperatures.
This device is designed to act as a heat dissipater, dissipating the excess heat created in various applications. It is also used in various electronic devices, such as computers, for cooling off the system.
The ATS-16A-72-C3-R0 thermal heat sink has a total weight of 4.4kg and a total thermal resistance of 0.084degC/W. It is capable of dissipating up to 4.3W of thermal energy. It is constructed of rigid aluminum material with a thermal compound layer already applied, ensuring long-term temperature stability.
This device is designed to operate in extreme temperatures and its high-performance guarantee ensures safe and reliable operation in these conditions. The 0.6-0.14mm gap between the fins helps reduce turbulence and the stability of the heat sink in high temperature conditions. The aluminum fins act as a thermal conductor, transferring the heat from the surface of the electronic device to the thermal compound applied to the heat sink’s base.
The thermal conductivity of the thermal compound helps to dissipate the heat generated from the surface of the electronic device, while the airflow created by the fins helps to provide an efficient cooling effect. This ensures optimal performance even in extreme temperatures. This device features a built-in temperature sensor to monitor the temperature fluctuations in the environment.
The ATS-16A-72-C3-R0 thermal heat sink can be widely used in a range of applications such as industrial equipment, communications devices, medical equipment, audio equipment, lighting systems, automotive components, and more. The device is also certified by UL for meeting safety and quality standards.
It is important to remember that the thermal conductivity of the thermal compound and the airflow created by the fins are essential in ensuring that the heat sink performs optimally in extreme temperatures. Also, careful consideration should be made when selecting the thermal compound to ensure the best possible performance from the thermal heat sink.
The specific data is subject to PDF, and the above content is for reference