| Allicdata Part #: | ATS-16A-81-C3-R0-ND |
| Manufacturer Part#: |
ATS-16A-81-C3-R0 |
| Price: | $ 3.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16A-81-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.31695 |
| 30 +: | $ 3.22707 |
| 50 +: | $ 3.04781 |
| 100 +: | $ 2.86858 |
| 250 +: | $ 2.68930 |
| 500 +: | $ 2.59965 |
| 1000 +: | $ 2.33071 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.22°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-16A-81-C3-R0 is a type of thermal heat sink. A heat sink is a device attached to a component to dissipate the heat it produces. This dissipates the energy and prevents the component from reaching temperatures that could cause it to malfunction, overheat, or even fail.
Heat sinks come in a variety of shapes and sizes and are used for various purposes. The ATS-16A-81-C3-R0 is used in applications where a large surface area is required. It features an 18" square base with a deep fin structure, providing ample surface area for cooling. The design is optimized to spread heat evenly across the component so as to keep it at a consistent operating temperature.
The ATS-16A-81-C3-R0 utilizes both active and passive cooling principles. Active cooling is achieved through convection, which is when air is allowed to flow around the device. The fins of the heat sink expand to increase the convective surface area, allowing for more efficient cooling. Passive cooling meanwhile works by using materials with a large thermal conductivity. Heat is then transferred through the material from the hotter components to the fins, where it then dissipates.
Another key feature of the ATS-16A-81-C3-R0 is its open-frame design. This allows for greater flexibility in mounting and positioning the component within the system. It also ensures that the air flow around the device is more evenly distributed, resulting in better cooling and greater reliability.
The ATS-16A-81-C3-R0 is an excellent choice for applications where a large surface area is needed for efficient cooling. Its open-frame design ensures maximum flexibility in mounting and positioning within the system, while its deep fin structure and optimized design provide superior cooling performance. Both passive and active cooling principles are employed to ensure that the device performs reliably and that the component remains at an optimal temperature.
The specific data is subject to PDF, and the above content is for reference