ATS-16B-103-C2-R1 Allicdata Electronics
Allicdata Part #:

ATS26612-ND

Manufacturer Part#:

ATS-16B-103-C2-R1

Price: $ 4.77
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X9.5MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-16B-103-C2-R1 datasheetATS-16B-103-C2-R1 Datasheet/PDF
Quantity: 1000
1 +: $ 4.34070
10 +: $ 4.22163
25 +: $ 3.98740
50 +: $ 3.75278
100 +: $ 3.51823
250 +: $ 3.28369
500 +: $ 3.04914
1000 +: $ 2.99050
Stock 1000Can Ship Immediately
$ 4.77
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.374" (9.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 27.67°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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The ATS-16B-103-C2-R1 Heat Sinks provide an efficient way to dissipate heat away from integrated circuits an other components within an electronic circuit. The heat sink works in a two stage process to draw energy away from components, and it is commonly used for applications such as CPU/GPU cooling, LED lighting, and electrical power supply applications.

Application Field

The ATS-16B-103-C2-R1 Heat Sinks is designed for use in various application fields.

The first application field is for cooling CPUs or GPUs. The heat sink design provides an alternative to traditional cooling methods such as fans and water cooling systems. The heat sink is designed to absorb heat away from the component during operation, which helps to ensure that the component does not overheat. The heat sink also helps to reduce overall system noise, by eliminating the need for additional cooling devices.

The second application field of the ATS-16B-103-C2-R1 Heat Sink is LEDs. This heat sink is designed to dissipate heat away from LEDs during operation, thus allowing for higher levels of brightness at lower levels of energy. This design also helps to preserve the life of the LED, as it prevents the LED from becoming too hot and burning out.

The final application field of the ATS-16B-103-C2-R1 Heat Sink is for electrical power supply applications. This heat sink design helps to reduce the amount of heat generated during operation, resulting in improved performance and energy efficiency. Additionally, the heat sink helps to prolong the life of electrical components by providing an efficient way to dissipate away any excess heat that may accumulate during operation.

Working Principle

The ATS-16B-103-C2-R1 Heat Sink operates using a two stage process. During the first stage, the heat sink dissipates heat away from components by using increasing the surface area of the heat sink. This is made possible by the heat sinks fins, which provide additional contact area.

The second stage occurs during operation. During this stage, the heat sink draws heat away from the component by conduction. This process occurs when the heat sink absorbs the energy generated by the component itself, and this energy is then dissipated through the heat sink. This process helps to reduce the amount of heat generated by the component, allowing for improved efficiency.

Conclusion

The ATS-16B-103-C2-R1 Heat Sink is an efficient way to dissipate heat away from integrated circuits and other components within an electronic circuit. The heat sink operates through a two stage process, which involves dissipating heat away from the component and then drawing away the energy generated by the component. This heat sink has multiple applications, including CPU/GPU cooling, LED lighting, and electrical power supplies.

The specific data is subject to PDF, and the above content is for reference

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