| Allicdata Part #: | ATS-16B-128-C1-R0-ND |
| Manufacturer Part#: |
ATS-16B-128-C1-R0 |
| Price: | $ 3.75 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16B-128-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.41208 |
| 30 +: | $ 3.31968 |
| 50 +: | $ 3.13526 |
| 100 +: | $ 2.95079 |
| 250 +: | $ 2.76641 |
| 500 +: | $ 2.67419 |
| 1000 +: | $ 2.39754 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-Heat Sinks are essential components in modern electronics. The ATS-16B-128-C1-R0 is one of the most widely used types of thermal-heat sinks. This article provides an overview of the ATS-16B-128-C1-R0, including its application field and working principle.
The ATS-16B-128-C1-R0 is a heat sink designed by ATS, a leading supplier in the thermal-heat sink industry. This type of heat sink is designed to dissipate heat from small- to medium-sized power dissipating components, such as power ICs, diodes, and transistors. It is suitable for surface mount technology (SMT) and through-hole components (THT). The ATS-16B-128-C1-R0 has a large thermal area and provides excellent cooling performance in a small package. This type of heat sink is extremely reliable, with a life expectancy of up to 50,000 hours.
The ATS-16B-128-C1-R0 features a number of design advantages that make it suitable for a wide range of applications. The heat sink is constructed from high-performance aluminum, which ensures optimal heat transfer. Furthermore, it features a unique fin configuration that helps facilitate efficient air flow, resulting in faster and more efficient cooling. The heat sink is also designed to be low-profile, allowing it to be mounted in confined spaces. It is low-maintenance and requires no additional lubrication or other maintenance.
The ATS-16B-128-C1-R0 is suitable for a wide range of electronic applications. It is ideal for applications where space and weight are a concern, such as in aerospace or automotive applications. The heat sink is also suitable for consumer electronics, as it is low-profile and lightweight. Additionally, the heat sink is suitable for industrial equipment, as it can withstand high temperatures and provide reliable cooling performance.
The working principle of the ATS-16B-128-C1-R0 is based on the principles of thermal-conduction. Heat is generated by components such as power ICs, diodes, and transistors, and is conducted to the heat sink by means of direct contact. Once the heat reaches the heat sink, it is dissipated by the aluminum fins. Airflow is then used to carry the heat away from the heat sink, resulting in efficient cooling.
In conclusion, the ATS-16B-128-C1-R0 is a reliable and efficient thermal-heat sink designed for a wide range of applications. It features an optimized fin design and rigid aluminum construction, providing excellent thermal efficiency and reliable cooling performance. Additionally, the heat sink is low-maintenance and can be mounted in confined spaces. The working principle of the ATS-16B-128-C1-R0 is based on the principles of thermal-conduction, with heat being conducted to the heat sink and dissipated through its aluminum fins.
The specific data is subject to PDF, and the above content is for reference