| Allicdata Part #: | ATS26653-ND |
| Manufacturer Part#: |
ATS-16B-140-C2-R0 |
| Price: | $ 3.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16B-140-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.20040 |
| 10 +: | $ 3.11472 |
| 25 +: | $ 3.03055 |
| 50 +: | $ 2.86209 |
| 100 +: | $ 2.69375 |
| 250 +: | $ 2.52542 |
| 500 +: | $ 2.44124 |
| 1000 +: | $ 2.18870 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.28°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is critical to the long-term performance of many electronic components, and thermal heat sinks are widely used to effectively transfer heat away from dangerous points. This is especially important for those who operate in high thermal environments or at high power. The ATS-16B-140-C2-R0 is an excellent example of a thermal heat sink used in many different applications.
The ATS-16B-140-C2-R0 is a heat sink designed for use with both high-power and low-power devices. The design consists of a main plate connected with two radial fins that contain a series of grooves. These grooves are pre-cut with specific depths and angles to increase the surface area available for the transfer of heat. The fins are made of aluminum, with a special coating to increase the thermal performance.
The ATS-16B-140-C2-R0 is designed to be used with a variety of electronic components, including semiconductors, integrated circuits, transistors, and power modules. The large surface area of the heat sink ensures efficient and reliable heat transfer away from the component, while the fins act as a heatsink to promote greater overall heat dissipation. This combination helps to keep the component operating at an optimum temperature, and helps to decrease the risk of damage from excessive heat.
One of the key elements of proper thermal management is the use of thermal interface materials (TIMs). These are thermal conductive paste-like substances that fill the voids between the heat sink and the component, creating a better connection between the two. In many cases, the ATS-16B-140-C2-R0 can accept a variety of TIMs, depending on the specific application and component power requirements.
Finally, the ATS-16B-140-C2-R0 also contains mounting, anchoring, and securing components that help ensure a secure fit between the heat sink and the component. These components, along with the TIMs, allow the user to create an effective bond between the two components, thus ensuring the most efficient possible thermal performance.
In conclusion, the ATS-16B-140-C2-R0 is an excellent thermal heat sink for many different applications. Its generous surface area, along with its radial fins and pre-cut grooves, promote excellent thermal performance, while its compatibility with many TIMs, along with its anchoring and securing components, help ensure the heat sink provides the best possible heat transfer. The ATS-16B-140-C2-R0 helps ensure devices remain within their desired temperature range, and prevents overheating and resulting damage, thus leading to greater overall reliability and performance.
The specific data is subject to PDF, and the above content is for reference