| Allicdata Part #: | ATS26655-ND |
| Manufacturer Part#: |
ATS-16B-142-C2-R0 |
| Price: | $ 3.84 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16B-142-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.49020 |
| 10 +: | $ 3.40011 |
| 25 +: | $ 3.30800 |
| 50 +: | $ 3.12430 |
| 100 +: | $ 2.94052 |
| 250 +: | $ 2.75675 |
| 500 +: | $ 2.66487 |
| 1000 +: | $ 2.38918 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are vital components in a wide variety of applications, from automotive and aerospace to industrial and computing. Thermal engineers have to strike a balance between cooling and cost-effectiveness, making thermal solutions an important part of the design process. The ATS-16B-142-C2-R0 heat sink is one such solution.
The ATS-16B-142-C2-R0 is an extruded aluminum heat sink that is designed to dissipate heat from components in thermal applications. The heat sink is designed for applications that may not require the highest level of cooling efficiency. The design of the ATS-16B-142-C2-R0 takes into account the cost, size, and effectiveness of the cooling solution.
The ATS-16B-142-C2-R0 is designed to have a standard fin design with a 0.1 mm fin thickness. The height of the heat sink is 142 mm. The design also allows for the mounting of components on the base. The heat sink has a high thermal conductivity rating of 170 W/mK and a total dissipated power rating of 7.52 W.
The ATS-16B-142-C2-R0 is well suited for use in low-heat dissipation applications such as automotive electronics, motherboards, communication systems, and other thermal applications. The design of the heat sink allows for maximum heat dissipation while the cost is kept low. The thermal performance of the ATS-16B-142-C2-R0 can also be enhanced by the use of a fan to increase air movement over the heat sink.
The ATS-16B-142-C2-R0 can also be used as a heat spreader in certain applications. When used as a heat spreader, the heat sink is placed between the component and the outside ambient. This helps to reduce the amount of heat transferred from the components to the ambient air by spreading the heat. The heat spreader is also useful in applications where the cooling requirements are more extreme, such as in high-power applications. Heat spreaders are often used in conjunction with heat sinks to ensure that the components stay within the desired temperature range.
The ATS-16B-142-C2-R0 is a reliable and cost-effective solution for many thermal applications. It provides an effective way to dissipate heat from components, while keeping costs low. The design is also flexible enough to allow for increased thermal performance should the need arise. The ATS-16B-142-C2-R0 is a great choice for any application that requires a reliable thermal solution.
The specific data is subject to PDF, and the above content is for reference