ATS-16B-148-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-16B-148-C1-R0-ND

Manufacturer Part#:

ATS-16B-148-C1-R0

Price: $ 3.45
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X15MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-16B-148-C1-R0 datasheetATS-16B-148-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.13866
30 +: $ 3.05361
50 +: $ 2.88401
100 +: $ 2.71435
250 +: $ 2.54470
500 +: $ 2.45987
1000 +: $ 2.20541
Stock 1000Can Ship Immediately
$ 3.45
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 8.56°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal management is a critical factor in any electronic circuit, as it affects the overall reliability and life expectancy of the circuit. The ATS-16B-148-C1-R0 heat sink is a great solution for heat removal in electronic systems, providing the correct amount of heat dissipation to keep components within their normal operating range. This article will explore the application field and working principle of the ATS-16B-148-C1-R0 heat sink.

The primary application field of the ATS-16B-148-C1-R0 heat sink is high-power dissipation applications, such as automotive electronics, home appliances, and personal computers. This heat sink is built with aluminum fins and copper base to provide efficient thermal transfer. The fins and base of the ATS-16B-148-C1-R0 heat sink are connected by a graphite/polyamide joint, which ensures an excellent thermal connection between the fins and base of the heat sink.

The working principle of the ATS-16B-148-C1-R0 heat sink is based on the concept of convection cooling. In convection cooling, the fins of the heat sink act as a radiator, dissipating heat away from the device or circuit to the ambient environment. As hot air rises, cool air is drawn in, providing a continuous stream of cooling air. This process is known as natural convection, and it is an efficient and effective way of cooling components within an electronic system.

In addition to natural convection, the ATS-16B-148-C1-R0 heat sink also features forced convection, which is achieved by a fan or blower. This allows for the efficient transfer of heat away from the heat sink, as the fan or blower will create an airflow to rapidly disperse the heat away from the device or circuit. When used in combination with natural convection, forced convection offers the most effective cooling solution for high-power dissipation applications.

The ATS-16B-148-C1-R0 heat sink is an excellent choice for thermal management in electronic systems. It offers the right amount of heat dissipation and will keep components and circuits within their normal operating range. In addition, the combination of natural convection and forced convection offers the most effective cooling solution for high-power dissipation applications. Whether you are looking for effective thermal management in an automotive application or a personal computer, the ATS-16B-148-C1-R0 heat sink is the perfect solution.

The specific data is subject to PDF, and the above content is for reference

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