| Allicdata Part #: | ATS-16B-154-C3-R0-ND |
| Manufacturer Part#: |
ATS-16B-154-C3-R0 |
| Price: | $ 4.00 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X15MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16B-154-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.64329 |
| 30 +: | $ 3.44106 |
| 50 +: | $ 3.23870 |
| 100 +: | $ 3.03629 |
| 250 +: | $ 2.83387 |
| 500 +: | $ 2.63145 |
| 1000 +: | $ 2.58084 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.61°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal – Heat Sinks are one of the most important components when designing and constructing electronic systems. The ATS-16B-154-C3-R0 is a particular type of Heat Sink designed for use in large electronic applications. This article will outline the application field and working principles of the ATS-16B-154-C3-R0 Heat Sink.
The ATS-16B-154-C3-R0 Heat Sink is designed for use in large, high end electronic applications. It is capable of dissipating up to 150 watts of power, making it ideally suited to applications where high power requirements are necessary. The Heat Sink comes in a range of sizes, from standard 2.5 inch square to 10 inch square. This wide range of sizes enables the user to select the appropriate size for their specific application.
In addition to its wide range of sizes, the ATS-16B-154-C3-R0 also features an advanced thermal design. This advanced design allows the Heat Sink to dissipate heat much more efficiently than a traditional Heat Sink. The Heat Sink features a beveled base design that increases the surface area, allowing for more efficient heat transfer. The beveled design also reduces airflow restriction, enabling the Heat Sink to keep the temperature of the components lower than a traditional Heat Sink.
The ATS-16B-154-C3-R0 Heat Sink also has a unique thermal design that ensures that the components underneath the Heat Sink remain safe. This is done by using high quality thermal pads that help transfer the heat away from the components. The pads are specifically designed to absorb and dissipate the heat from the components, thus helping to keep the components cool while also protecting them from damage.
The ATS-16B-154-C3-R0 Heat Sink is also made with high quality materials that result in a more durable and reliable product. The Heat Sink is constructed from lightweight aluminum alloy that enables the Heat Sink to be easily mounted to any surface. The aluminum construction also helps maintain a consistent temperature on the surface of the Heat Sink, resulting in a more efficient heat transfer.
Along with the aluminum construction, the ATS-16B-154-C3-R0 Heat Sink also includes a high-efficiency thermal interface material that helps to further increase the efficiency of heat transfer. This thermal interface material helps to prevent heat from being trapped between the Heat Sink and the component, thus increasing the overall cooling ability of the Heat Sink.
Overall, the ATS-16B-154-C3-R0 Heat Sink is an excellent choice for applications that require high power requirements and effective heat transfer. With its wide range of sizes, advanced thermal design, high quality materials, and efficient thermal interface material, the ATS-16B-154-C3-R0 Heat Sink is well suited for any large electronic application.
The specific data is subject to PDF, and the above content is for reference