ATS-16B-155-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	5.47°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction
ATS-16B-155-C3-R0 is a thermal- heat sink used in high-temperature electronics and telecommunications applications. By utilizing an advanced cooling technology, ATS-16B-155-C3-R0 is designed to allow heat to be dissipated quickly and efficiently from sensitive components in these applications. Furthermore, its compact size and weight makes it an ideal choice for applications where space is a concern.
Application Field
ATS-16B-155-C3-R0 thermal- heat sink is used primarily in high-temperature electronics or telecommunications applications. Its efficient heat removal ensures that critical components in these systems do not overheat and malfunction. Moreover, its small form factor makes it an optimal choice for applications where space is an issue. It is ideal for applications that require thermally efficient cooling, such as high-efficiency switchgear, and radio or television transmission. Working Principle
ATS-16B-155-C3-R0 thermal-heat sink works by dissipating heat away from sensitive components in high-temperature applications. The design of this device employs an advanced cooling technology that increases thermal transfer efficiency. Heat is regulated by a series of heat pipes that draw heat away from the components, and then into the thermal-heat sink. The heat is them moved by convection or forced air, depending on the application. The combination of heat pipes and air flow optimizes the heat transfer process and ensures efficient cooling. Advantages
The primary benefit of ATS-16B-155-C3-R0 thermal-heat sink is its efficient cooling. This allows it to effectively manage heat produced by high-temperature electronics or telecommunications applications. Furthermore, its small size and weight makes it an ideal choice for applications where space is a concern. Moreover, its compact design ensures minimal air resistance for improved performance. Lastly, the device has an efficient heat removal rate, meaning less heat accumulates and dissipates slower, helping to maintain optimal temperatures.
Conclusion
ATS-16B-155-C3-R0 thermal-heat sink is an advanced technological device primarily used in high-temperature electronics and telecommunications applications. By utilizing an advanced cooling technology, it can effectively manage heat produced by such systems. Furthermore, its small size and weight make it a great option for applications where space is a concern. With its efficient heat removal and minimal air resistance, it is an ideal choice for applications that require thermally efficient cooling.

The specific data is subject to PDF, and the above content is for reference