| Allicdata Part #: | ATS26686-ND |
| Manufacturer Part#: |
ATS-16B-170-C2-R0 |
| Price: | $ 3.84 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16B-170-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.49020 |
| 10 +: | $ 3.40011 |
| 25 +: | $ 3.30800 |
| 50 +: | $ 3.12430 |
| 100 +: | $ 2.94052 |
| 250 +: | $ 2.75675 |
| 500 +: | $ 2.66487 |
| 1000 +: | $ 2.38918 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are a type of mechanical assemblies that utilize heat sinks to manage heat levels in electrical and electronic equipment. The ATS-16B-170-C2-R0 is a heat sink specifically designed to improve air flow, linear fan speeds, and maximize thermal performance. This heat sink is ideal for applications requiring high performance thermal management.
A heat sink is typically made from aluminum or copper and works to dissipate excess heat by transferring it from the hottest component to the cooler ambient air. Heat sinks have fins that extend from the main body of the heatsink, which increases the rate of heat transfer from the component to the air. The ATS-16B-170-C2-R0 has 170 fins designed to provide a large thermal interface area, which allows for efficient heat dissipation while ensuring a low fan speed and noise level.
The ATS-16B-170-C2-R0 also features a specialized design that is intended to maximize air flow and linear fan speeds. The thermal performance of the design is also optimized through fin spacing adjustments and optimized fin angles. This ensures maximum thermal performance with a low fan speed. The special design also reduces turbulent air flow, eliminates acoustic noise, and reduces hotspots.
This heat sink is an ideal choice for applications that require high performance thermal management. It is suitable for industrial control, computer mainboards, rectifiers, UPS, telecommunications equipment, AC drives, and other high power electronic devices. The overall performance of the device is designed to provide superior reliability and thermal performance while consuming minimal energy.
The ATS-16B-170-C2-R0 heat sink is an efficient and reliable thermal management device that is designed for optimum performance. Its fin design and optimized linear fan speeds ensure effective and reliable heat dissipation while consuming minimal energy. This makes it an ideal choice for applications that require high performance thermal management.
The specific data is subject to PDF, and the above content is for reference