| Allicdata Part #: | ATS-16B-177-C1-R0-ND |
| Manufacturer Part#: |
ATS-16B-177-C1-R0 |
| Price: | $ 3.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X20MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16B-177-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.19788 |
| 30 +: | $ 3.11157 |
| 50 +: | $ 2.93857 |
| 100 +: | $ 2.76576 |
| 250 +: | $ 2.59291 |
| 500 +: | $ 2.50647 |
| 1000 +: | $ 2.24717 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.18°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal – Heat Sinks
Thermal management is a critical factor influencing the performance and life expectancy of many electrical and electronic components. Heat sinks are one of the most effective tools employed by engineers for dissipating heat generated by electronic components. Heat sinks are designed to act as a collector and dissipator of heat produced by any power device, IC or component.
ATS-16B-177-C1-R0 is a type of heat sink that uses an aluminum core with a highly efficient pin fin design. It is designed to provide excellent thermal performance when mounted in restricted zone applications. It has a vertical-wing configuration that evenly disperses the heat dissipation across the entire surface of the heat sink body.
In more particular terms, the ATS-16B-177-C1-R0 employs a raw aluminum core with an integral fin design that offers low thermal resistance and dissipates heat from electronic components effectively. This heat sink has a symmetrical design, which allows for mounting in any orientation. For efficient heat dissipation, the ATS-16B-177-C1-R0 also utilizes vertically-oriented fins that maximize its heat exchange performance.
Its unique thermal design also allows it to be mounted in tight space applications without compromising on heat dissipation. The ATS-16B-177-C1-R0 is capable of operating efficiently even when there is limited airflow in the application area. The pin fin design also improves heat exchange in places where traditional heat sinks might not be suitable.
The ATS-16B-177-C1-R0 is also designed to be a low-profile heat sink, which allows for reduced system heights in many applications. This allows designers to incorporate the ATS-16B-177-C1-R0 into their systems without compromising board space.
The ATS-16B-177-C1-R0 is ideal for applications in the automotive, medical, industrial, communications, telecommunications, and consumer electronics industries. Its thermal performance and low profile design make it perfect for high-power applications that require efficient heat dissipation in confined spaces.
The ATS-16B-177-C1-R0 has been designed to provide excellent thermal performance in challenging environments, making it a top choice for heat sink applications.
The specific data is subject to PDF, and the above content is for reference