ATS-16B-25-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-16B-25-C1-R0-ND

Manufacturer Part#:

ATS-16B-25-C1-R0

Price: $ 4.81
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-16B-25-C1-R0 datasheetATS-16B-25-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.32621
30 +: $ 4.08555
50 +: $ 3.84527
100 +: $ 3.60499
250 +: $ 3.36466
500 +: $ 3.12432
1000 +: $ 3.06424
Stock 1000Can Ship Immediately
$ 4.81
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 6.25°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks

The ATS-16B-25-C1-R0 is a heat sink designed to keep an electronic device at the correct operating temperature. It is a device made of a metal material that has thermally conductive properties, designed to absorb thermal heat from an electronic processor and dissipate it into the surrounding environment. By maintaining a low temperature, the work environment is cooler which leads to improved performance, better efficiency, and protection of the system from heat-related problems.

Application Field

The ATS-16B-25-C1-R0 is designed for use on a wide variety of electronic devices. It is suitable for use in industrial, consumer, and other electronic environments. Commonly found in computers, servers, consumer electronics, electronic circuit boards, and many other applications, they can also be used in electric vehicles, industrial process controllers, telecommunications, avionics, and many other environments.

The main components of an electronic system, such as the processor, memory, power supply, and other peripheral devices, can each generate a lot of heat during operation. These components all rely on the heat sink to keep the system temperature consistent and protect the electronic components from potential damage due to heat.

Working Principle

The ATS-16B-25-C1-R0 uses heat conduction to transfer heat away from the source and into the surrounding environment. The thermally conductive properties of the metal used in the heat sink allow heat to easily travel from the processor or other heat generating component to the heat sink. The heat sink then absorbs the heat and dissipates it into the surrounding air, keeping the device cool. This process works in both directions, allowing the device to keep relatively cool even when in an environment that is hot.

The ATS-16B-25-C1-R0 is characterized by its high thermal conductivity and ability to dissipate heat quickly. Thanks to its efficient heat dissipation, it helps keep the temperature of the device within safe operating limits and ensures a stable, reliable operation. This ensures that the system has a long life and has reliable performance in demanding applications.

The ATS-16B-25-C1-R0 is an essential component of any electronic system, as it keeps the system running at its optimum performance level. With its excellent heat dissipation, it allows the device to reach its maximum performance while maintaining stability and reliability.

The specific data is subject to PDF, and the above content is for reference

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