ATS-16B-28-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-16B-28-C1-R0-ND

Manufacturer Part#:

ATS-16B-28-C1-R0

Price: $ 6.22
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 70X70X15MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-16B-28-C1-R0 datasheetATS-16B-28-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 5.59818
30 +: $ 5.28738
50 +: $ 4.97624
100 +: $ 4.66528
250 +: $ 4.35426
500 +: $ 4.04324
1000 +: $ 3.96549
Stock 1000Can Ship Immediately
$ 6.22
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.756" (70.00mm)
Width: 2.756" (70.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 10.57°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is an important aspect in the operation of electronic systems, and heat sinks are one of the most common thermal management solutions. The ATS-16B-28-C1-R0 heat sink is a high performance unit designed for high-density applications such as server racks and telecom systems. It is made of high-grade aluminum and is designed to dissipate heat more efficiently, allowing for greater cooling performance.

The ATS-16B-28-C1-R0 heat sink utilizes a patented ProFlow® technology, which provides a more efficient heat dissipation pattern by using an internal aluminum cast core. The core has a series of pockets, which are filled with an aluminum matrix composite material that forms a near heat-sealed connection with the heat source. The aluminum matrix composite also enhances contact with the heat source to further enhance heat dissipation.

The ATS-16B-28-C1-R0 heat sink is designed for direct insertion into a server rack or other high-density applications. It is designed to fit into all standard form-factors, including 3U, 4U and 6U. The unit is also available with optional air and water cooling solutions. The air cooling solution utilizes chilled air to reduce the maximum temperature of the heat sink, and the water cooling solution is ideal for applications where additional cooling is required.

The ATS-16B-28-C1-R0 heat sink has an area of 217cm2, a wall thickness of 0.25mm, and a thermal performance of 0.15W/K. It is designed to handle up to 105W of heat dissipation, and has an operating temperature range of -20°C to 70°C. The heat sink has a variable height to ensure a good fit in different applications.

The ATS-16B-28-C1-R0 heat sink is an ideal cooling solution for high-density applications. It offers good thermal performance and its ProFlow® technology provides a more efficient heat dissipation pattern. The air and water cooling solutions offer additional flexibility, and the adjustable height ensures a good fit. This makes the ATS-16B-28-C1-R0 heat sink a great choice for high-density applications where cooling is a priority.

The specific data is subject to PDF, and the above content is for reference

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