| Allicdata Part #: | ATS-16B-32-C3-R0-ND |
| Manufacturer Part#: |
ATS-16B-32-C3-R0 |
| Price: | $ 5.66 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X11.43MM T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16B-32-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.08914 |
| 30 +: | $ 4.80669 |
| 50 +: | $ 4.52390 |
| 100 +: | $ 4.24116 |
| 250 +: | $ 3.95842 |
| 500 +: | $ 3.67567 |
| 1000 +: | $ 3.60499 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 21.54°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are thermally managed devices that are used to move, store, and dissipate heat. Heat is moved from hot spots within an enclosed environment and transferred to adjacent areas. It is important to note that when heat is moved away from hot spots, or when it is dissipated into the environment, temperature increases between the hot spot and the target area, often known as the thermal gradient.
ATS-16B-32-C3-R0 is a high performance heat sink produced by Advanced Thermal Solutions, Inc. which promises enhanced cooling performance compared to conventional designs. This particular heat sink is designed for transmitting heat away from high density CPUs, graphics chips, and other high performance chipsets. The design of this device supports distributed cooling, allowing heat to spread out across a large area in order to reduce necessary air flow and reduce turbulence.
The ATS-16B-32-C3-R0 is a low-profile device that is designed to fit into the tight space of computer system mechanical designs. It features flexible thermal fin patterns that can be manipulated as needed to ensure maximum heat transfer. Additionally, this device utilizes an advanced design of air flow and distribution with an enhanced water block cooling mechanism. This helps ensure even dispersion of the heat sink fins to decentralize its thermal load.
As an effective thermal management device, the ATS-16B-32-C3-R0 is an excellent choice for applications such as PC and laptop CPUs, graphics chipsets, server CPUs, and other high-power devices. By utilizing a low-profile construction and advanced air/water flow distribution, the ATS-16B-32-C3-R0 provides superior heat transfer capabilities in a compact form factor.
This heat sink features advanced engineering and manufacturing techniques to provide an outstanding thermal solution for demanding applications. Its superior construction and insert molding features ensures consistent second-level assembly for a long-lasting and reliable performance.
The ATS-16B-32-C3-R0 is an advanced thermal management system designed to effectively move heat away from devices and dissipate it into the environment. The heat sink\'s novel design utilizes air/water flow distribution and advanced materials to provide superior heat transfer capabilities, while its flexibility of thermal fin patterns ensures efficient heat dispersion. As a result of its low-profile construction and advanced engineering, the ATS-16B-32-C3-R0 is ideal for cooling high-power modules such as server CPUs, graphics chips, and laptop CPUs.
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