ATS-16B-33-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	2.280" (57.90mm)
Width:	1.450" (36.83mm)
Diameter:	--
Height Off Base (Height of Fin):	0.700" (17.78mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	17.40°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are essential components in the majority of electronic systems because they help manage temperatures, and dissipate heat away from delicate equipment. The ATS-16B-33-C1-R0 is a highly efficient heat sink model that has been used in many industrial applications. This article will explore the application field and working principle of ATS-16B-33-C1-R0.

Application Field of ATS-16B-33-C1-R0

The ATS-16B-33-C1-R0 is designed to dissipate the thermal energy produced by large, complex systems. It is particularly useful in industrial applications due to its excellent performance and reliable service life. Its application field includes, but is not limited to:- Industrial Automation: Automated robotic systems usually generate a lot of heat, and the high performance of the ATS-16B-33-C1-R0 helps to ensure efficient temperature control and enhanced performance.- Telecommunications: The ATS-16B-33-C1-R0 helps to reduce the temperature of high-powered telecommunications systems, such as rigs, server farms, and so on.- Military: The ATS-16B-33-C1-R0 is also used in military applications. It helps ensure reliable performance in any environment, as it can withstand high levels of shock and vibration.

Working Principle of ATS-16B-33-C1-R0

The ATS-16B-33-C1-R0 uses a combination of thermal energy dissipation and cooling strategies to minimize the temperature of the system it is installed in. This heat sink model is capable of dissipating upwards of 80 Watts of thermal energy.When heat is generated in an electronic system, it is conducted to the heat sink, where it is dissipated from the surface. The ATS-16B-33-C1-R0 also uses a unique passive cooling system. This system consists of a series of closely spaced, high-performance copper fins. These fins help increase the surface area of the heat sink, thereby enhancing its cooling capabilities even further.The ATS-16B-33-C1-R0 also includes a fan, which further improves thermal energy dissipation. The fan draws in air from the environment and circulates it over the heat sink. This helps to remove the heat faster and more efficiently than other heat sink models.

Conclusion

The ATS-16B-33-C1-R0 is a highly efficient heat sink model that is designed for use in industrial applications. This model combines excellent heat energy dissipation techniques with an effective passive cooling system and a powerful fan to maximize thermal energy dissipation. As such, the ATS-16B-33-C1-R0 is an ideal choice for electronic systems that generate a considerable amount of heat.

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