| Allicdata Part #: | ATS-16B-37-C2-R0-ND |
| Manufacturer Part#: |
ATS-16B-37-C2-R0 |
| Price: | $ 5.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X17.78MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-16B-37-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.39028 |
| 30 +: | $ 5.09061 |
| 50 +: | $ 4.79128 |
| 100 +: | $ 4.49177 |
| 250 +: | $ 4.19232 |
| 500 +: | $ 3.89287 |
| 1000 +: | $ 3.81801 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.700" (17.78mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.12°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management has become increasingly important in the world of electronics. The ability to dissipate heat away from chip components like processors and memory chips has been indispensable in modern electronic devices. One of the most popular tools for this task is the ATS-16B-37-C2-R0 heat sink, a powerful cooling device that can dissipate a large amount of heat at a low cost. This article will discuss the application field of ATS-16B-37-C2-R0 and its working principle.
The ATS-16B-37-C2-R0 is a thermal management solution designed for applications where heat must be efficiently removed from integrated circuits (ICs) and other sensitive components. This type of heat sink features an efficient four-channel design that allows airflow through each channel to efficiently dissipate the heat away from the component it is protecting. This is especially useful in applications that require minimal heat dissipation and robust heat sink resistance, such as microprocessors and power ICs.
The ATS-16B-37-C2-R0 has a high efficiency rating, but it is also relatively inexpensive compared to other solutions. This makes it a popular choice for thermal management, especially when it comes to production lines. To further increase its efficiency, it is designed with an independently controllable fan mounted on top. This fan can be set to spin faster at higher temperatures to help with the dissipation of heat.
In order to understand how the ATS-16B-37-C2-R0 works, it is important to first understand the basics of heat transfer. Heat travels from a hot surface to a cold one in order to create equilibrium. The aluminum fins on the ATS-16B-37-C2-R0 act as a heat exchanger between the component and the ambient air. The aluminum fins absorb the heat from the component and dissipate it to the surrounding air. This is why it is important to ensure the Thermal Resistance Rth of the ATS-16B-37-C2-R0 is as low as possible, to maximize heat dissipation.
In addition to dissipating heat, the ATS-16B-37-C2-R0 also allows for temperature control. This is especially important in applications such as automotive electronics or industrial power electronics. By attaching temperature sensors to the ATS-16B-37-C2-R0, the fan speed can be adjusted to maintain optimum temperature levels. This can help prevent component damage due to excessive temperatures.
The ATS-16B-37-C2-R0 heat sink is a versatile and effective thermal management solution. It is capable of both dissipating heat from components and controlling operating temperatures, making it a popular choice for many thermal management applications. It is relatively inexpensive compared to other solutions and has an efficient four-channel design that helps to maximize its efficiency.
The specific data is subject to PDF, and the above content is for reference
ATS-16B-37-C2-R0 Datasheet/PDF