| Allicdata Part #: | ATS26747-ND |
| Manufacturer Part#: |
ATS-16B-50-C2-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16B-50-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.38310 |
| 10 +: | $ 3.29301 |
| 25 +: | $ 3.20393 |
| 50 +: | $ 3.02602 |
| 100 +: | $ 2.84798 |
| 250 +: | $ 2.67002 |
| 500 +: | $ 2.58101 |
| 1000 +: | $ 2.31400 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 19.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important factor when dealing with electronic components. Heat sinks help to dissipate heat away from components, reducing the risk of damaging or burning them. The ATS-16B-50-C2-R0 is a type of thermal solution designed to maintain temperatures within accepted ranges and ensure that electronics are kept safe. This article will explain the application field and working principle of the ATS-16B-50-C2-R0.
Application Field of ATS-16B-50-C2-R0
The ATS-16B-50-C2-R0 is a type of finned heat sink designed for use in many different types of electronic devices. It is made from aluminum and features a thermally conductive mid-plane substrate and press fitted fins for better heat conduction. It is capable of dissipating heat both actively and passively, making it suitable for a wide variety of applications.
The ATS-16B-50-C2-R0 is a popular choice for applications where efficient cooling is required. It can be used in high power devices, such as powerful circuit boards, amplifiers, and LED drivers. It is also suitable for applications where precise temperature control is needed, such as digital signage and medical equipment. The ATS-16B-50-C2-R0 has also been found to be effective when used in server racks, data centers, and other large systems where heat buildup can cause problems.
Working Principle of ATS-16B-50-C2-R0
The ATS-16B-50-C2-R0 works by dissipating heat away from the components. It uses two different methods to do this, active and passive cooling. Active cooling involves using a fan to draw heat away from the components and out of the system. This method provides better cooling performance, but is often more expensive and requires more energy to run.
Passive cooling, on the other hand, uses the inherent properties of the ATS-16B-50-C2-R0 to radiate heat away from the components. This occurs through the conduction and convection of heat away from the components. The cold air within the system is then displaced by the warmer air from the components, providing an efficient and cost-effective cooling method.
The ATS-16B-50-C2-R0 is designed to provide maximum cooling performance while at the same time reducing energy consumption. It features a unique fin design that is designed to maximize surface area which in turn increases the amount of heat that can be dissipated away from the components. The ATS-16B-50-C2-R0 also features a low profile design that allows it to be used in tight spaces where other heat sinks cannot fit.
The ATS-16B-50-C2-R0 is a highly efficient and reliable heat sink solution. It is suitable for use in a wide range of applications, from high power LED drivers to medical equipment. Its efficient design and reasonable price make it a popular choice for many thermal management systems.
The specific data is subject to PDF, and the above content is for reference