| Allicdata Part #: | ATS-16B-55-C1-R0-ND |
| Manufacturer Part#: |
ATS-16B-55-C1-R0 |
| Price: | $ 3.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16B-55-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.92446 |
| 30 +: | $ 2.84550 |
| 50 +: | $ 2.68733 |
| 100 +: | $ 2.52926 |
| 250 +: | $ 2.37119 |
| 500 +: | $ 2.29216 |
| 1000 +: | $ 2.05503 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 23.94°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management in modern electronic equipment is essential to ensure optimum performance. High temperatures can reduce the lifespan of the electronic components, causing operational problems and even damage. In order to protect these components from overheating, it is necessary to use thermal solutions such as heat sinks that dissipate the heat generated by the electronic components. One such heat sink is the ATS-16B-55-C1-R0, which is designed to provide superior cooling performance. This article discusses the application field and working principle of the ATS-16B-55-C1-R0.
Applications Field
The ATS-16B-55-C1-R0 is designed to provide superior cooling performance for high-power and high-density applications. The small size and low-profile design of the ATS-16B-55-C1-R0 makes it an ideal thermal solution for applications where space is limited. It is suitable for a wide range of applications including:
- Power semiconductor modules
- Power regulators
- Power LEDs
- Networking devices
- Telecommunication devices
- Small form-factor PCs
Working Principle
The ATS-16B-55-C1-R0 is designed to dissipate a high amount of heat generated by the electronic components. The heat sink is made up of an aluminium extrusion base with a number of fins that increase the surface area for maximum heat dissipation. The heat sink also features a thermally conductive adhesive to provide a better thermal connection between the components and the heat sink. The fins are arranged in an angular pattern that enables air to easily circulate through the fins, which increases the heat dissipation rate. The contact area between the fins and the components also has pin holes that enable the efficient transfer of heat from the fins to the components. This ensures that the ATS-16B-55-C1-R0 provides superior cooling performance at all times.
The ATS-16B-55-C1-R0 is lightweight and small, making it an ideal thermal solution for applications where space is limited. The heat sink has a robust design and is able to withstand a wide range of operating temperatures. The heat sink is also corrosion-resistant, making it highly durable. The ATS-16B-55-C1-R0 has a long service life and is capable of providing reliable cooling performance for many years.
Conclusion
The ATS-16B-55-C1-R0 is a thermal solution designed to provide superior cooling performance for high-power and high-density applications. It is made up of an aluminium extrusion base with fins that increase the surface area for maximum heat dissipation. The heat sink also features a thermally conductive adhesive that improves thermal connection. The small size and low-profile design make it an ideal thermal solution for applications where space is limited. The ATS-16B-55-C1-R0 is designed to provide reliable and efficient cooling performance for many years.
The specific data is subject to PDF, and the above content is for reference