| Allicdata Part #: | ATS-16B-60-C1-R0-ND |
| Manufacturer Part#: |
ATS-16B-60-C1-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16B-60-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.58596 |
| 30 +: | $ 3.38646 |
| 50 +: | $ 3.18730 |
| 100 +: | $ 2.98809 |
| 250 +: | $ 2.78888 |
| 500 +: | $ 2.58968 |
| 1000 +: | $ 2.53987 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.33°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are an important part of any thermal management system, and the ATS-16B-60-C1-R0 heat sink is no exception. The ATS-16B-60-C1-R0 heat sink is an aluminum extrusion heat sink designed to provide maximum cooling efficiency for a variety of applications, including electronics, medical, telecommunications, and industrial.
The ATS-16B-60-C1-R0 heat sink is a low-profile device designed to minimize the height and profile of the heat sink by using a compact, anodized aluminum extrusion. The heat sink is also adjustable, so the amount of air flow that can be achieved can be adjusted to best meet the specific application\'s cooling requirements.
The ATS-16B-60-C1-R0 heat sink uses a highly efficient design to ensure that it is able to efficiently dissipate the heat generated by the components of the system. The heat sink features a cooling fin array, which consists of extruded fins with a fin pitch of 16mm. The cooling fin array is designed to take advantage of the natural convective airflow generated by the components in the system. This airflow helps to take excess heat away from the components, and helps to ensure that the components remain at a safe operating temperature. The heat sink also features a robust louvered center section, which helps to insulate the heat sink from hot spots in the system.
The ATS-16B-60-C1-R0 heat sink has an array of features to ensure the highest level of cooling efficiency and convenience. The heat sink features an internal pin grid array (PGA) system, which allows the user to easily mount the heat sink to the cooling elements in the system. The heat sink also has an array of customizable fan mounting options, which allow the user to choose the ideal fan solution for their particular application.
The ATS-16B-60-C1-R0 heat sink also offers some unique features that enhance the thermal performance of the device. For example, the heat sink features a nickel-titanium alloy thermal pad, which helps evenly disperse heat throughout the heat sink and allows it to better handle higher temperatures. The heat sink also features a built-in backplate that helps to ensure that the heat sink stays securely in place, and also helps to reduce the possibility of air leakage.
The ATS-16B-60-C1-R0 heat sink is designed to be used in a wide variety of electronic, medical, telecommunications, and industrial applications. The heat sink provides an efficient way to dissipate the heat generated by the components in the system and ensure that the system remains at a safe operating temperature. The heat sink features an efficient fin array and adjustable cooling fins, as well as customizable fan mounting options. The ATS-16B-60-C1-R0 heat sink also features a nickel-titanium alloy thermal pad and an integrated backplate to help ensure secure mounting and reduce the possibility of air leakage. The ATS-16B-60-C1-R0 heat sink is designed to provide efficient thermal management for a variety of applications.
The specific data is subject to PDF, and the above content is for reference