| Allicdata Part #: | ATS-16B-65-C1-R0-ND |
| Manufacturer Part#: |
ATS-16B-65-C1-R0 |
| Price: | $ 4.02 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16B-65-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.65526 |
| 30 +: | $ 3.45198 |
| 50 +: | $ 3.24904 |
| 100 +: | $ 3.04592 |
| 250 +: | $ 2.84286 |
| 500 +: | $ 2.63980 |
| 1000 +: | $ 2.58903 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.27°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal Heat Sinks are essential components for many mechanical applications and electronic systems. The ATS-16B-65-C1-R0 thermal heat sink is a high-performance active heat sink designed for high-power applications such as motor drives, servers, and other high-power devices.
This device offers a low profile and efficient heat dissipation over a wide range of temperatures. It is made from a combination of aluminum and copper materials and is designed with multiple layers for increased heat transfer efficiency. The design also allows the heat to dissipate into the surrounding environment to reduce overall heat output.
The ATS-16B-65-C1-R0 thermal heat sink is designed with an array of fins and has a sharply defined edge. This edge helps to increase the effectiveness of the heat sink and disperses the heat evenly over the entire surface area. The fins also help to increase the surface area available for heat exchange. This increased surface area helps to reduce the time needed for dissipating the heat from the device.
This thermal heat sink also offers a number of active heat control features designed to reduce the temperature of the device. This is done through the use of heat sinks fans and thermally controlled resistors. The fans are designed to move the hot air away from the device and reduce the temperature of the device. The thermally controlled resistors help to regulate the amount of heat that is dissipated from the device. These resistors are used in combination with a temperature sensing system to adjust the amount of heat transferred from the device.
The ATS-16B-65-C1-R0 thermal heat sink is also designed with a process that helps to reduce noise. The design features a number of channels in the fins that help to absorb and distribute sound waves. This helps to reduce the overall noise created by the thermal heat sink and allows it to be used in more extreme environments.
The ATS-16B-65-C1-R0 thermal heat sink is a high performance active heat sink designed to offer excellent heat transfer and cooling efficiency. It comes with a number of features designed to ensure that the device runs smoothly and efficiently. Those features, combined with its low profile and efficient heat dissipating design, make the ATS-16B-65-C1-R0 an ideal solution for high-power applications.
The specific data is subject to PDF, and the above content is for reference