ATS-16B-87-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-16B-87-C3-R0-ND

Manufacturer Part#:

ATS-16B-87-C3-R0

Price: $ 3.78
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X20MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-16B-87-C3-R0 datasheetATS-16B-87-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.43539
30 +: $ 3.24450
50 +: $ 3.05361
100 +: $ 2.86278
250 +: $ 2.67193
500 +: $ 2.48108
1000 +: $ 2.43337
Stock 1000Can Ship Immediately
$ 3.78
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 13.30°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management plays a crucial role in modern electronics and electrical appliances, where the cooling of critical components is essential for their efficient operation and long-term performance. The ATS-16B-87-C3-R0 heat sink is one of the most reliable and efficient cooling solutions available for these applications.

The ATS-16B-87-C3-R0 heat sink is a heat dispersion device that uses fins to help dissipate heat from the system. It is designed to mount directly on top of CPUs, GPUs, and other critical components to prevent them from becoming too hot and potentially damaging internal circuitry and other components. The heat sink uses a combination of natural convection, air flow, and forced convection to ensure efficient cooling.

The heat sink design is accurate and reliable, with an optimized design that ensures maximum heat dissipation while requiring minimal clearance space. It is constructed using a special aluminum alloy that has excellent thermal conductivity, and the surface is treated with a special coating to ensure that it will not corrode or wear away over time. The heat sink features a unique triangular fin design that maximizes its total surface area available for heat dissipation, and the heat-dissipating fins are open at the bottom for better air flow.

The ATS-16B-87-C3-R0 heat sink is ideal for applications where efficient and reliable cooling is a must. It is particularly suitable for applications that require high power dissipation or long-term, continuous operation. It is also designed to ensure good compatibility with most modern CPUs and GPUs, making it an ideal choice for any system that requires efficient cooling. The heat sink also features a universal mount design that can be adapted to fit most electronic components, making installation quick and easy.

Overall, the ATS-16B-87-C3-R0 heat sink is one of the most reliable and efficient cooling solutions available for thermal management. Its accurate and reliable design, combined with its efficient cooling features, makes it an ideal choice for any system that requires efficient cooling and long-term performance. The heat sink is also compatible with most modern CPUs and GPUs, making it the perfect choice for any application that requires efficient and reliable cooling.

The specific data is subject to PDF, and the above content is for reference

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