
Allicdata Part #: | ATS26794-ND |
Manufacturer Part#: |
ATS-16B-97-C2-R0 |
Price: | $ 4.33 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 45X45X10MM R-TAB T766 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
1 +: | $ 3.93750 |
10 +: | $ 3.82851 |
25 +: | $ 3.61595 |
50 +: | $ 3.40326 |
100 +: | $ 3.19051 |
250 +: | $ 2.97781 |
500 +: | $ 2.76511 |
1000 +: | $ 2.71193 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.772" (45.00mm) |
Width: | 1.772" (45.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.394" (10.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 20.30°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is a critical component in the design of most electronic systems and applications. Heat is produced as a result of internal power loss, and must be dissipated to protect components and ensure the extended life of any system. The removal of heat from a system or device is known as thermal management, and heat sinks are among the most common solutions used.The ATS-16B-97-C2-R0 is a high performance aluminum heat sink produced by Delta Electronics. It is designed for a broad range of applications, offering high thermal performance, ease of installation and long term durability. The ATS-16B-97-C2-R0 is suitable for use in a variety of applications, including server components, video cards, and high performance GPUs.When used as part of a system or device, the ATS-16B-97-C2-R0 serves two primary functions. The first is to reduce the operating temperature of the system or device, and the second is to reduce the amount of power consumed by the system or device. Its design allows for maximum heat dissipation, while also eliminating the need for active cooling. This is accomplished through a number of features, including a special fin structure that increases the surface area for improved heat exchange, and a special coating that prevents oxidation and corrosion.The ATS-16B-97-C2-R0 is available in a number of sizes and thicknesses to suit a variety of applications. For example, the ATS-16B-97-C2-R0 can be used in Intel Xeon processors in order to ensure long life and overclocking performance. The heat sink is also suitable for use with other CPUs, GPUs, servers and other high power logic electronics. The ATS-16B-97-C2-R0 is designed to be employed in thermal management applications that require minimum airflow and low noise levels. Its fin structure helps to maximize the surface area, which ensures that the heat generated by the system is effectively dissipated. The use of high performance aluminum alloy, combined with a special coating, ensures that the heat sink will not degrade over time and that it will remain an effective solution for thermal management applications.The ATS-16B-97-C2-R0 is not only an effective thermal management solution, but it is also reliable and cost-effective. The aluminum alloy construction ensures that the heat sink is durable and that it will not require frequent maintenance. Additionally, the heat sink is designed to be compatible with existing hardware, meaning that installation is straightforward and easy. In conclusion, the ATS-16B-97-C2-R0 is an excellent thermal management solution for a wide variety of applications. Its aluminum alloy construction and unique fin structure ensure maximum heat dissipation, while its special coating prevents oxidation and corrosion. The heat sink is also durable, compatible with existing hardware, and provides a cost-effective solution for thermal management applications.
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