
Allicdata Part #: | ATS26807-ND |
Manufacturer Part#: |
ATS-16C-100-C2-R0 |
Price: | $ 4.97 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 45X45X25MM R-TAB T766 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
1 +: | $ 4.51710 |
10 +: | $ 4.39551 |
25 +: | $ 4.15120 |
50 +: | $ 3.90701 |
100 +: | $ 3.66282 |
250 +: | $ 3.41863 |
500 +: | $ 3.17444 |
1000 +: | $ 3.11340 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.772" (45.00mm) |
Width: | 1.772" (45.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 8.70°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are an important part of modern electronics and are widely used in many industrial and consumer products. The ATS-16C-100-C2-R0 thermal-heat sink is a cooling solution designed specifically for applications where aggressive heat dissipation is required. It features a compact, modular design with an innovative heat pipe structure.
The ATS-16C-100-C2-R0 utilizes an innovative heat-pipe-based heat dissipation technology that provides effective cooling performance for applications like CPUs, GPUs, and other components that require aggressive thermal management. Heat pipes are composed of evaporator and condenser sections, and when the evaporator portion absorbs heat from the component, the condenser portion dissipates it by dissipating it to the surroundings. This makes the ATS-16C-100-C2-R0 highly efficient in dissipating heat from compact components while taking up minimal space in the device.
The ATS-16C-100-C2-R0’s heat pipes are composed of aluminum or copper, which is heat conductor material, and a filling material that is liquid at normal room temperature. Heat pipes use the natural convection of hot air to transfer heat evenly throughout the entire pipe structure, allowing for efficient and uniform heat dissipation. The ATS-16C-100-C2-R0 is also equipped with a high-efficiency fan that further enhances its heat dissipation capabilities.
The ATS-16C-100-C2-R0 is an ideal cooling solution for applications that require quick and efficient heat dissipation. It can be used for cooling a range of components such as CPUs, GPUs, FPGAs, and other devices. Its compact design and modular construction makes it easily adaptable to most systems. Additionally, it is resistant to oxidation and corrosion, and is compatible with most components.
The ATS-16C-100-C2-R0 is an excellent choice for electronic devices that require an efficient cooling solution. It utilizes a combination of heat pipes and a high-efficiency fan to efficiently and effectively dissipate heat. Its compact design and modular construction makes it easily adaptable to most systems. Additionally, its robust design is resistant to oxidation and corrosion, making it a great choice for components that require aggressive cooling and heat dissipation.
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