| Allicdata Part #: | ATS-16C-116-C3-R0-ND |
| Manufacturer Part#: |
ATS-16C-116-C3-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16C-116-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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.ATS-16C-116-C3-R0 Thermal - Heat Sinks
Heat sinks are devices used to transfer heat away from electronic and mechanical components, protecting them from damage. The ATS-16C-116-C3-R0 is a type of heat sink that specializes in transferring heat away from electronic components such as CPUs and GPUs, and is commonly used in computers and other electronic equipment.
The ATS-16C-116-C3-R0 is constructed from durable aluminum alloy. It measures 116mm in length, 16mm in width, and has a 3mm thickness. This makes it well-suited for dissipating small amounts of heat in tight spaces. It also has a durable black anodized finish that offers an additional layer of protection for the exposed metal.
The ATS-16C-116-C3-R0 is designed for efficient heat transfer. It features a regularly-spaced array of micro-struts, which increase surface area for greater heat dissipation. The micro-struts are also designed with a dielectric organic solderability preservative (DOSP) coating, which prevents arcing damage.
The ATS-16C-116-C3-R0 is designed to work with a variety of mounting systems, including a standard central screw for fastening onto a circuit board. It also features an integrated mount for attaching to a fan. This design allows for greater flexibility when attempting to dissipate heat away from electronic components.
The ATS-16C-116-C3-R0 is designed to work with a variety of airflow systems. It features a patented AirFlow Pattern Technology, which helps ensure that air is evenly and efficiently distributed throughout the heat sink’s array of micro-struts. This technology allows for efficient heat transfer, even in smaller, more confined spaces.
The ATS-16C-116-C3-R0 is a powerful and efficient heat sink. It is designed to be used in a variety of applications, including personal computers, servers, and other electronic equipment. It is capable of dissipating small amounts of heat in tight spaces, with greater efficiency thanks to its array of micro-struts and integrated mounting systems.
The specific data is subject to PDF, and the above content is for reference