| Allicdata Part #: | ATS-16C-117-C1-R0-ND |
| Manufacturer Part#: |
ATS-16C-117-C1-R0 |
| Price: | $ 3.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16C-117-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.78208 |
| 30 +: | $ 2.70669 |
| 50 +: | $ 2.55629 |
| 100 +: | $ 2.40591 |
| 250 +: | $ 2.25553 |
| 500 +: | $ 2.18034 |
| 1000 +: | $ 1.95479 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A thermal-Heat sink is a device or material that helps to transfer heat from one object to another while reducing the temperature of the original object. The ATS-16C-117-C1-R0 is a specialized type of thermal-heat sink designed for applications in high-precision electronics. It is designed to improve Thermal design performance and reduce Thermal rise, while providing a more efficient and reliable way to transfer heat away from sensitive components.
Application Field
The ATS-16C-117-C1-R0 is engineered for integrated circuit packages and other small modules and boards that require reliable thermal heat dissipation. This thermal-heat sink is an ideal asset for controlling the temperatures in smaller, more accurate parts, such as in processing power supplies, LEDs, LCDs, and server and communications systems; where these parts often require a smaller temperature control.
Working Principle
The thermal-heat sink is comprised of two parts: a base metal, typically aluminum, which is designed to conduct heat away from the components to be cooled, and fins that are fixed to the base metal and extend outside of it to increase the surface area available for heat transfer. The fins act as radiators, transferring heat away from the base while the metal material directly transfers the thermal energy away from the component.
In a typical application, the ATS-16C-117-C1-R0 is fixed to the side of the component and the component is firmly affixed to the heat sink. Heat is then transferred away from the component and to the heat sink by either conduction or convection. The heat is then transferred away from the heat sink much more quickly and efficiently than without it.
The heat sink also increases the efficiency of airflow around vital components and boards. By creating pockets of air, the heat sink allows the air to freely flow and cool any area where the heat sink is located instead of clogging such areas with static air.
Conclusion
The ATS-16C-117-C1-R0 is a thermal-heat sink designed for use in a variety of precision electronics applications. Its design is based on metal and fin-shaped radiators which transfer heat away from sensitive components. It is an ideal asset for controlling temperatures in smaller, more accurate parts and for increasing the efficiency of airflow around vital components and boards.
The specific data is subject to PDF, and the above content is for reference