| Allicdata Part #: | ATS-16C-124-C3-R0-ND |
| Manufacturer Part#: |
ATS-16C-124-C3-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16C-124-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.58596 |
| 30 +: | $ 3.38646 |
| 50 +: | $ 3.18730 |
| 100 +: | $ 2.98809 |
| 250 +: | $ 2.78888 |
| 500 +: | $ 2.58968 |
| 1000 +: | $ 2.53987 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.25°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are important components within electronic systems and are designed to dissipate the heat produced by the electronic components they are attached to. The thermal management of the electronics is important to ensure long life and reliable operation. The ATS-16C-124-C3-R0 is a popular heat sink used in a variety of applications. This article will discuss the application fields and working principle of the ATS-16C-124-C3-R0.
The ATS-16C-124-C3-R0 heat sink is designed for use with electronic components that require active cooling. It has high thermal performance and low thermal resistance. This heat sink is designed to be used in a variety of applications ranging from consumer electronics to medical devices and industrial applications. It is also compatible with many different processor types.
When it comes to the application fields of the ATS-16C-124-C3-R0 heat sink, it is mainly used for cooling components such as CPUs, GPUs, RAM, Northbridges, and Southbridges. It is also suitable for cooling high-power components such as LEDs, fans, servo motors, dc motors, switches, power modules, and other components. This heat sink can also be used for cooling power supplies, power amplifiers, and other applications.
The ATS-16C-124-C3-R0 has four thermal fins connected to an aluminum base plate with four mounting holes. This heat sink has a special airflow design that maximizes its cooling capacity. Air is drawn into the heat sink through the fins and passes over the hot component. The heated air is then expelled out of the heat sink, taking the heat away from the component.
The working principle of the ATS-16C-124-C3-R0 heat sink is based on thermodynamics. The heat generated by the components transfers through the heat sink and is dissipated into the surrounding environment through the thermal fins. This process is known as convection and it is an efficient way of cooling electronic components.
The ATS-16C-124-C3-R0 heat sink is a reliable and efficient solution for cooling electronic components. It is designed for use in a wide range of applications, and its special airflow design ensures maximum cooling performance. The heat sink is easy to install and its thermal performance is excellent. This heat sink is a great choice for thermally-sensitive applications.
The specific data is subject to PDF, and the above content is for reference