| Allicdata Part #: | ATS26851-ND |
| Manufacturer Part#: |
ATS-16C-140-C2-R0 |
| Price: | $ 3.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16C-140-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.20040 |
| 10 +: | $ 3.11472 |
| 25 +: | $ 3.03055 |
| 50 +: | $ 2.86209 |
| 100 +: | $ 2.69375 |
| 250 +: | $ 2.52542 |
| 500 +: | $ 2.44124 |
| 1000 +: | $ 2.18870 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.28°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management solutions are essential for achieving optimal performance and reliability of electronic devices, and heat sinks are one of the most commonly used methods. The ATS-16C-140-C2-R0 heat sink in particular is designed for a variety of applications and its design includes several features that allow for efficient thermal management. This article will explore the application field and working principle of the ATS-16C-140-C2-R0 heat sink in detail.
Application Field of the ATS-16C-140-C2-R0 Heat Sink
The ATS-16C-140-C2-R0 heat sink is designed for a variety of applications, primarily as cooling components in servers, workstations, and other high-performance computer systems. The ATS-16C-140-C2-R0 is also suitable for a range of commercial and industrial applications, such as telecommunications, automotive, and medical applications. Its unique design also allows it to be used as a heatsink for chips in laptops and other mobile devices.
The ATS-16C-140-C2-R0 heat sink is designed for use in systems ranging from low-power embedded devices to high-performance server applications. It is designed to provide efficient cooling regardless of the size and complexity of the system.
Working Principle of the ATS-16C-140-C2-R0 Heat Sink
The ATS-16C-140-C2-R0 heat sink utilizes a combination of features to provide efficient thermal management. Its construction includes a base made from aluminum alloy, which is then machined to optimize airflow and heat dissipation. The base is topped with a series of fins and a fan, both of which aid in the cooling process.
The aluminum alloy base provides a low-impedance heat transfer path, reducing the thermal resistance of the heat sink and allowing heat to be dissipated quickly and efficiently. The finned design of the heat sink also increases its surface area, further aiding in the heat transfer process. The fan increases the airflow around the heat sink, improving the heat dissipation rate even further. In addition, the fan also helps to reduce the noise level produced by the system.
The combination of features in the ATS-16C-140-C2-R0 heat sink ensures efficient thermal management for a range of applications. By providing efficient cooling, the heat sink helps to maintain the optimal performance and reliability of a wide range of electronic devices, ranging from low-power embedded devices to multi-core high-performance systems.
Conclusion
The ATS-16C-140-C2-R0 heat sink is an efficient thermal management solution for a variety of applications. Its aluminum alloy base and finned design provide an effective thermal transfer path, while the fan increases the airflow and heat dissipation rate. This combination of features makes the ATS-16C-140-C2-R0 an ideal heatsink for high-performance computer systems, servers, and other commercial and industrial applications.
The specific data is subject to PDF, and the above content is for reference