Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.969" (50.00mm)
Width:	1.969" (50.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.42°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are an essential component of any electronic device. It acts as a bridge between the electronic components and the outside environment, allowing for efficient temperature regulation. ATS-16C-15-C1-R0 is a high performance, low-power, and low-cost thermal heat sink which can be applied to various applications. In this article, we will take a closer look at ATS-16C-15-C1-R0, and discuss its application field and working principle.

Application Field of ATS-16C-15-C1-R0

ATS-16C-15-C1-R0 is a highly efficient thermal heat sink which is suitable for various applications. It is mainly used in power semiconductor modules. It can dissipate minimal waste heat from power semiconductor modules, with excellent thermal performance. Additionally, it can be used for cooling of thermoelectric devices, providing excellent heat dissipation in high temperature environments. Furthermore, it can be used in signal communication devices, and assist in the management of noise and voltage across chips and other components.The ATS-16C-15-C1-R0 is designed to meet the industry\'s highest standards, and it is compatible with most common heatsink and base materials. It has an operating temperature range of -55°C to +125°C, which makes it suitable for applications where extreme temperatures are encountered. In addition, it meets the IEC60950-1 standard and UL 94-V0 fire safety requirements, making it ideal for applications where high safety is required.

Working Principle

The ATS-16C-15-C1-R0 uses a unique combination of technologies to achieve its high performance and quality. The thermal heat sink uses the principle of convection heat transfer to dissipate heat away from the electrical components. In simple terms, convection is the transfer of heat from one place to another through the motion of a fluid. When the ambient temperature outside the enclosure rises, the fluid (air) will flow into the enclosure and carry away heat which has been generated by the components. This convective motion will thus help to reduce the temperature of the components in the enclosure.The ATS-16C-15-C1-R0 uses a combination of fins and finned heat sinks to increase the surface area which would be in direct contact with the outside air. Fins are typically made from aluminum or copper which has high thermal conductivity, and the increased surface area helps to significantly increase the rate of convection. The fins are arranged in a unique pattern to optimize the heat transfer process, while providing excellent coverage and uniformity across the entire surface of the device. Furthermore, the ATS-16C-15-C1-R0 also utilizes passive air penetration. As the air passes through the fins, it creates a cooling effect which further helps to dissipate heat away from the components. This passive air penetration is an efficient method of cooling, and results in a cooler and more stable thermal environment for the device.

Conclusion

In conclusion, ATS-16C-15-C1-R0 is a high-performance, low-power thermal heat sink which is suitable for various applications. It utilizes a combination of technologies, such as convection heat transfer and passive air penetration, to provide high performance cooling with excellent coverage and uniformity across the entire device. This makes it an ideal choice for applications where extreme temperatures are encountered. From power semiconductor modules to thermoelectric devices and signal communication devices, the ATS-16C-15-C1-R0 provides excellent heat dissipation and optimal cooling.

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