ATS-16C-158-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-16C-158-C1-R0-ND

Manufacturer Part#:

ATS-16C-158-C1-R0

Price: $ 3.85
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X35MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-16C-158-C1-R0 datasheetATS-16C-158-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.49335
30 +: $ 3.29910
50 +: $ 3.10502
100 +: $ 2.91098
250 +: $ 2.71691
500 +: $ 2.52285
1000 +: $ 2.47433
Stock 1000Can Ship Immediately
$ 3.85
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 2.77°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-16C-158-C1-R0 is a thermal management solution designed to provide excellent thermal performance on a variety of applications. It is a heat sink with two fin modules with an integrated heatsink base. This heat sink features an innovative design which allows it to maximize its ability to dissipate heat from components. It has a maximum fin height of 0.5” (13 mm) and a fin area of 16.7 sq inches (108 cm2).

The ATS-16C-158-C1-R0 is best used in high performance and industrial applications, such as: power electronics, telecommunications, automotive, aerospace, and data storage. These applications will benefit from its ability to effectively remove heat from high-power components. The integrated base plate allows for easy mounting of components, while the two fin modules provide excellent thermal performance.

The ATS-16C-158-C1-R0 works by absorbing heat from the components it is connected to. The heat is quickly dissipated into the atmosphere thanks to the two fin modules and integrated base plate, which provide a large surface area for heat exchange. This ensures the components stay at optimal operating temperatures with minimal thermal resistance. The two fin modules also reduce air flow Turbulence, allowing the heat to be dissipated more efficiently.

In addition, the ATS-16C-158-C1-R0 features superior heat conduction and resistance to oxidation and corrosion, ensuring it is stable and reliable over time. This makes it ideal for long-term and continuous operations, as well as a wide variety of industrial applications.

The ATS-16C-158-C1-R0 is an effective thermal management solution for applications requiring maximum heat dissipation. It combines an innovative design with superior construction to ensure excellent thermal performance and reliability. It is perfect for applications in the power electronics, telecommunications, automotive, aerospace, and data storage fields. The ATS-16C-158-C1-R0 is a proven heat sink solution with excellent performance.

The specific data is subject to PDF, and the above content is for reference

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