| Allicdata Part #: | ATS-16C-160-C1-R0-ND |
| Manufacturer Part#: |
ATS-16C-160-C1-R0 |
| Price: | $ 3.66 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X15MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16C-160-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.32892 |
| 30 +: | $ 3.23862 |
| 50 +: | $ 3.05878 |
| 100 +: | $ 2.87885 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.60896 |
| 1000 +: | $ 2.33906 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.65°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-16C-160-C1-R0 is a heat sink designed to dissipate heat away from high-performance electronics and other sensitive equipment. It features a large fin area which makes it an efficient heat dissipation system. The aluminum fin construction helps it to lower its thermal resistance. The fins are precision formed and are designed to ensure air flows freely around them.
Heat sinks are essential in any electronic system, as they help to regulate the temperature of the components. As the heat dissipates away from the component, the temperature inside the device can stay within a safe and comfortable range. Overheating can cause unexpected failure or damage to sensitive components.
The ATS-16C-160-C1-R0 heat sink is designed to be used in a variety of applications. It is suitable for a variety of electronics, such as microprocessors, ASICs, and even LEDs. It can also be used with telecom equipment, semiconductor devices, and discrete components. The material used in the construction is corrosion-resistant and does not accumulate static electricity, making it ideal for use in sensitive applications.
The working principle of ATS-16C-160-C1-R0 heat sink is based on convection. Heat is produced by the component when it’s working and is then transferred to the heat sink. The fins increase the amount of surface area exposed to the air, allowing more air to pass over it and take away the heat. This effectively cools down the component in question.
The design of the heat sink also helps to maximize thermal performance. They feature louvers and other design elements that help to increase air velocity through the fin array. This helps air to more effectively transfer the heat away from the component. The ability of the heat sink to dissipate heat is determined by its size, construction, and type of fin material used.
For applications where cooling needs are higher such as LED systems, installing a fan or other active cooling system can help boost the thermal performance of the ATS-16C-160-C1-R0. This can help to reduce the amount of heat produced by the component and increase its longevity and reliability.
In conclusion, the ATS-16C-160-C1-R0 is an effective and efficient heat sink designed for a variety of applications. Its thermal performance is maximized through its fin array construction and design features. When used in combination with other elements such as active cooling systems, this makes it an ideal choice for high-performance and sensitive applications.
The specific data is subject to PDF, and the above content is for reference