| Allicdata Part #: | ATS-16C-167-C1-R0-ND |
| Manufacturer Part#: |
ATS-16C-167-C1-R0 |
| Price: | $ 3.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16C-167-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.82933 |
| 30 +: | $ 2.75289 |
| 50 +: | $ 2.60001 |
| 100 +: | $ 2.44705 |
| 250 +: | $ 2.29408 |
| 500 +: | $ 2.21761 |
| 1000 +: | $ 1.98820 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are essential for cooling electronic components and regulating their arrangement. The ATS-16C-167-C1-R0 is an advanced heat sink that is designed to reduce internal ambient temperature and provide reliable protection against overheating. This heat sink system utilizes an innovative design that combines both phase-change materials and large dissipative heat sinks to provide maximum cooling capacity and total system protection.
The ATS-16C-167-C1-R0 heat sink has been designed for use with embedded CPUs. It is a robust, self-contained heat sink unit that makes use of phase-change material to regulate the temperature of internal components. This material rapidly absorbs heat and then slowly releases the heat as it transitions from solid to liquid, and then back again. This process helps to provide relatively constant thermal regulation and consistent performance.
The ATS-16C-167-C1-R0 also uses large dissipative heat sinks to remove heat from the environment quickly and efficiently. Dissipative heat sinks are constructed from a material such as aluminum which absorbs heat, and then dissipates it to the surrounding environment via convection. This makes them ideal for cooling embedded CPUs, as they can quickly and efficiently transfer heat away from the processor to reduce internal temperatures.
In addition to phase-change materials and dissipative heat sinks, the ATS-16C-167-C1-R0 also uses a proprietary cooling technology. This technology employs a combination of base plates, enclosure panels, and fans to move air throughout the unit to cool down internal components efficiently. The air is then ejected through an exhaust port at the rear of the unit, keeping the inside of the case free from dust and debris.
In addition to regulating temperature and protecting against overheating, the ATS-16C-167-C1-R0 heat sink also provides a secure installation for embedded CPUs. It includes sturdy, tamper-proof mounting feet, which provide a secure, reliable connection to the motherboard. The enclosure itself is also designed with a dust cover, which keeps internal components free from dust and debris. The cover is quick and easy to remove when access is needed.
The ATS-16C-167-C1-R0 is an advanced heat sink system that can effectively regulate both ambient and internal temperatures. It is designed for use with embedded CPUs, and includes both phase-change materials and dissipative heat sinks to provide maximum cooling capacity and total system protection. The unit also includes sturdy mounting feet, a dust cover, and a proprietary cooling technology to ensure secure installation and efficient cooling.
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