ATS-16C-186-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	2.80°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to ATS-16C-186-C2-R0

The ATS-16C-186-C2-R0 (ATS16C186C2R0) is a robust, low-profile thermal heat sink designed for advanced thermal management applications. The ATS16C186C2R0 utilizes advanced materials and techniques to provide superior thermal performance, low-profile design, increased airflow, and minimal mounting hardware. This thermal heat sink is an ideal choice for a wide range of uses, including automotive, industrial, military, and other difficult-to-cool applications.

Primary Applications for the ATS-16C-186-C2-R0

The ATS16C186C2R0 is ideal for applications where cooling of power components is required. This thermal heat sink offers optimum thermal performance for processors, memory, ASICs/ASSPs, and power supplies, among other devices. The ATS16C186C2R0 can be used in systems that require space conservation because of its compact size and low-profile design.This thermal heat sink is well suited for automotive, industrial, military, portable, and commercial applications such as computers, servers, telecom, and automotive systems. This thermal heat sink offers excellent thermal performance in high-power applications. Additionally, the ATS16C186C2R0 is RoHS compliant.

Working Principles of the ATS-16C-186-C2-R0

The ATS16C186C2R0 works by dissipating the heat that is generated by the processor or memory chips during their operation. The thermal heat sink utilizes advanced technologies such as advanced plate and fin structures, high-efficiency heat pipes, and pin fin designs to effectively absorb and dissipate heat. The design of the ATS16C186C2R0 ensures maximum thermal performance with minimal airflow requirements and minimal mounting hardware.The ATS16C186C2R0 utilizes an innovative pin-fin design that increases the lifespan of the thermal heat sink. This design allows airflow to pass through the thermal heat sink with less resistance, thereby allowing high heat transfer efficiency. It also makes the installation of the thermal heat sink a simple process.The ATS16C186C2R0 is designed to work in a wide range of operating temperatures, from -40°C to +105°C. This thermal heat sink’s exceptional performance makes it an ideal choice for harsh environment applications.

Conclusion

The ATS-16C-186-C2-R0 (ATS16C186C2R0) is a robust, low-profile thermal heat sink designed for advanced thermal management applications. This thermal heat sink offers numerous advantages, such as increased airflow, superior thermal performance, low-profile design, and minimal mounting hardware. This thermal heat sink is ideal for power component cooling in automotive, industrial, military, portable, and commercial applications. The ATS16C186C2R0 is designed to work in a wide range of operating temperatures, from -40°C to +105°C. This thermal heat sink’s innovative pin-fin design greatly increases its lifespan and makes it an ideal choice for harsh environment applications.

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