| Allicdata Part #: | ATS-16C-193-C1-R0-ND |
| Manufacturer Part#: |
ATS-16C-193-C1-R0 |
| Price: | $ 3.02 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X6MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16C-193-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.72223 |
| 30 +: | $ 2.64873 |
| 50 +: | $ 2.50160 |
| 100 +: | $ 2.35450 |
| 250 +: | $ 2.20735 |
| 500 +: | $ 2.13376 |
| 1000 +: | $ 1.91302 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.236" (6.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 21.05°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks refers to a heat transfer system that dissipates heat generated by electronic components into the environment. ATS-16C-193-C1-R0 is a type of heat sink commonly used in computer hardware and other high-powered electronic devices. It is one of the most popular and widely used types of thermal management solutions for high-power applications.
The ATS-16C-193-C1-R0 consists of a copper plate as the main element of the heat sink. This plate is anodized with a black oxide finish to increase its conductivity and anti-corrosion capacity. The copper plate is also designed with a series of fins that increase the heat transfer area, allowing it to dissipate heat more effectively than a base plate alone could do. The fins also help to increase the surface area of the plate, allowing the heat to dissipate more quickly.
ATS-16C-193-C1-R0 heat sink is suitable for a variety of applications, such as in PCs, servers, workstations, motherboards, and other computing devices. It is also used in military, power supplies, aerospace, and other areas. Additionally, it has a good air-cooling effect, making it suitable for environments with a continuous, high-power output.
The working principle of the ATS-16C-193-C1-R0 is based on the concept of convective cooling. As the device warms up, the air molecules around it become charged, creating a convective flow. As this current travels around the fins of the heat sink, it is able to dissipate the heat away from its source. This process lowers the temperature of the area and prevents it from becoming too hot.
The ATS-16C-193-C1-R0 is a versatile solution for managing heat in high-power applications. Its design and construction make it effective in dissipating and transferring heat, thereby helping to keep components and systems cool. Its working principle and application field make it suitable for a variety of applications, including gaming and server systems, making it an invaluable addition to any data management or cooling system.
The specific data is subject to PDF, and the above content is for reference