| Allicdata Part #: | ATS-16C-202-C3-R0-ND |
| Manufacturer Part#: |
ATS-16C-202-C3-R0 |
| Price: | $ 3.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X6MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16C-202-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.45870 |
| 30 +: | $ 3.26634 |
| 50 +: | $ 3.07415 |
| 100 +: | $ 2.88206 |
| 250 +: | $ 2.68992 |
| 500 +: | $ 2.49779 |
| 1000 +: | $ 2.44975 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.236" (6.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.94°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-Heat Sinks are an important component for regulating the temperature of electrical systems. An efficient cooling system is essential for successful operation of any electronic device, and ATS- 16C-202-C3-R0 is an example of a heat sink specifically designed to meet this need.
This particular heat sink is made from a combination of aluminum and carbon steel. The aluminum is used to absorb the heat generated by the device, while the carbon steel is used to provide a strong, lightweight frame. The combination of materials makes this heat sink highly efficient at dissipating heat and ensuring the device is kept at an optimum temperature.
The ATS- 16C-202-C3-R0 heat sink is typically used in consumer electronic goods and other applications where a small, low-wattage device is used. It is also commonly used on circuit boards to help avoid component overheating. The heat sink is designed to be compatible with a wide range of components, from transistors to microprocessors.
The ATS- 16C-202-C3-R0 has a working principle that is based on thermal conduction. As the heat from the device passes through the sink, it is drawn away from the device and dispersed through the surrounding air. This process helps to maintain the device\'s operating temperature and protect the components from excessive heat build up.
The primary purpose of this heat sink is to keep the temperature of the device within a safe range of operation. By preventing overheating, the sink helps to ensure the safety and reliable operation of the device. It is also able to minimize the amount of energy used by the device, boosting its overall efficiency.
The ATS- 16C-202-C3-R0 is a reliable and efficient heat sink that is well-suited for use in a range of applications. Its combination of aluminum and carbon steel make it suitable for use in areas where high temperatures and high power are expected, such as consumer electronics. The heat sink is also able to absorb heat from a wide range of components and is compatible with a variety of circuit boards, making it the ideal choice for a range of applications.
In conclusion, the ATS- 16C-202-C3-R0 is an effective and reliable heat sink that is ideally suited for use in a range of applications. Its combination of aluminum and carbon steel make it the perfect choice for dissipating heat and keeping the device operating at an optimal temperature. The working principle of the heat sink, based on thermal conduction, ensures that the device is kept within a safe temperature range, while also helping to minimize energy used.
The specific data is subject to PDF, and the above content is for reference