| Allicdata Part #: | ATS-16C-204-C3-R0-ND |
| Manufacturer Part#: |
ATS-16C-204-C3-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X12MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16C-204-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.58596 |
| 30 +: | $ 3.38646 |
| 50 +: | $ 3.18730 |
| 100 +: | $ 2.98809 |
| 250 +: | $ 2.78888 |
| 500 +: | $ 2.58968 |
| 1000 +: | $ 2.53987 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.54°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are an integral part of many electronic components and systems. Heat sinks, in particular, are essential to the operation of systems in the aerospace, automotive, consumer, and other industries. The ATS-16C-204-C3-R0 is an advanced thermal-heat-sink solution designed to address the thermal challenges of a variety of applications. The following sections will provide an overview of its application field and working principle.
Application Field
The ATS-16C-204-C3-R0 can be used in a wide range of applications, from commercial and data processing systems to aerospace and defense systems. It is designed to handle high-power components and can be used in applications that require cooling of light- emitting and thermal control components, as well as other heat-sensitive applications. Additionally, the ATS-16C-204-C3-R0 can be used in fanless systems, which require silent thermal management.
With its high-performance material, the ATS-16C-204-C3-R0 is able to absorb and dissipate large amounts of heat across its surface area. This ensures reliable cooling for components with thermal outputs of up to 220W. Additionally, the ATS-16C-204-C3-R0 is designed for use in demanding environments, including high-temperature, dusty, and shock or vibration applications.
Working Principle
The working principle of the ATS-16C-204-C3-R0 is based on the principles of thermodynamics. Heat generated within the system is absorbed by the ATS-16C-204-C3-R0 and converted into thermal energy. The thermal energy is then dissipated into the environment via direct radiation and natural convection, as well as conduction (when the ATS-16C-204-C3-R0 is mounted onto a conductive object).
To ensure optimal thermal performance, the ATS-16C-204-C3-R0 is specifically designed for optimal cooling efficiency. Its optimized fin array provides excellent airflow and heat dissipation. Additionally, its high-performance aluminum substrate ensures efficient heat absorption and conduction. Finally, the ATS-16C-204-C3-R0 employs a temperature-controlled fan to achieve higher cooling capacity when operating in high-temperature environments.
The ATS-16C-204-C3-R0 also features an advanced thermal management system. The system includes a temperature sensor that monitors the temperature of the heat sink and automatically adjusts the fan speed to ensure optimal cooling performance. The fan speed is adjustable, allowing users to customize the cooling performance according to their needs.
Conclusion
The ATS-16C-204-C3-R0 is a highly advanced thermal-heat-sink solution designed to meet the specific needs of a wide range of applications. Its optimized fin array allows for excellent heat dissipation, while its temperature-controlled fan ensures optimal cooling. Furthermore, the ATS-16C-204-C3-R0 features an advanced thermal management system, allowing for optimal performance in high-temperature environments. In short, the ATS-16C-204-C3-R0 is a reliable and highly efficient thermal- heat-sink solution.
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