
Allicdata Part #: | ATS-16C-207-C3-R0-ND |
Manufacturer Part#: |
ATS-16C-207-C3-R0 |
Price: | $ 4.68 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 60X60X12MM XCUT T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 4.21029 |
30 +: | $ 3.97635 |
50 +: | $ 3.74245 |
100 +: | $ 3.50860 |
250 +: | $ 3.27469 |
500 +: | $ 3.04079 |
1000 +: | $ 2.98231 |
Specifications
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 2.362" (60.00mm) |
Width: | 2.362" (60.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.472" (12.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 6.47°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Description
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The ATS-16C-207-C3-R0 is a component that is categorized under Thermal - Heat Sinks. It is a heat sink that plays an important role in the field of hardware technology. Heat sinks help regulate the temperature of electronic components, allowing them to remain at the desired operational level. Without a properly functioning heat sink, electronic components will be prone to failure due to an inability to disperse heat.When an electronic component is in use, it generates heat. This is known as the internal power of the component, or the power that is generated from the internal resistance of the component. The internal power is typically higher than the external power, which can cause the component to overheat if left unchecked. Heat sinks effectively dissipate heat away from the component, allowing the component to maintain the desired temperature.The ATS-16C-207-C3-R0 is an advanced thermal-heat sink solution that features a two-piece aluminum design for superior heat transfer. It also uses patented technology to ensure effective heat conduction from the heat source to the fins. The aluminum alloy used for the heat conduction fins is high quality and corrosion resistant, which further enhances its heat dissipation capability.The ATS-16C-207-C3-R0 is designed for use in a wide array of applications, such as server and storage rooms, telecom rack enclosures, and other high-demand applications. It features a slim, low-profile design, allowing it to be easily installed in tight spaces. Additionally, it is extremely durable, and is designed to withstand high temperatures and vibration.In addition to the superior heat transfer and durability, the ATS-16C-207-C3-R0 also offers superior thermal stability and an even heat distribution. It ensures that components remain at the desired operational temperature, allowing for optimal performance. This helps increase the lifespan of the hardware, as well as minimize energy costs associated with cooling. The ATS-16C-207-C3-R0 is a reliable and efficient thermal-heat sink solution, that can help ensure the continued operation of a wide array of components.
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