| Allicdata Part #: | ATS26927-ND |
| Manufacturer Part#: |
ATS-16C-21-C2-R0 |
| Price: | $ 5.54 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16C-21-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 5.04000 |
| 10 +: | $ 4.90455 |
| 25 +: | $ 4.63176 |
| 50 +: | $ 4.35935 |
| 100 +: | $ 4.08694 |
| 250 +: | $ 3.81448 |
| 500 +: | $ 3.54201 |
| 1000 +: | $ 3.47390 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 16.28°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are used to transfer thermal energy away from various heat sources, such as processors, circuit boards, and power supplies. In order to improve the efficiency and longevity of these components, it is necessary to maintain a relatively low temperature to reduce the rate of overheating. The ATS-16C-21-C2-R0 is one of the most reliable and powerful heat sinks available that excels at keeping temperatures low.
The ATS-16C-21-C2-R0 is designed with a rectangular base, which measures at 161.4mm x 169.4mm x 55mm. The base is then attached to a series of fin-like components, which extend upwards from the base and significantly increase the surface area of the heat sink. The fins are made from thermally adequate materials such as aluminum or copper, allowing them to absorb heat quickly and efficiently. As a result, the ATS-16C-21-C2-R0 is the perfect solution for dissipating heat from various sources.
The ATS-16C-21-C2-R0 is designed to effectively absorb and disperse heat from heat sources, such as processors, power supplies, and circuit boards. The unit is rated to handle up to 200 watts of heat, making it the ideal choice for applications which require a powerful and reliable heat sink. Additionally, the ATS-16C-21-C2-R0 features a PWM-controlled fan, which is capable of regulating the air flow of the heat sink based on the temperature of the heat source. This means that the fan will be able to maintain the ideal temperature for the components, without wasting power or causing unnecessary noise.
In order to function correctly, the ATS-16C-21-C2-R0 must be connected to a power source. Depending on the type of application, the unit may require a 12V DC power source or alternatively, a 3-pin fan connector. Once the power source is connected, the fan will begin operation, drawing air away from the heat source and dissipating it through the fins of the heat sink. This process allows the ATS-16C-21-C2-R0 to maintain a relatively cool environment for the components, and is essential for applications which require a durable and long-lasting solution.
Overall, the ATS-16C-21-C2-R0 is an excellent choice for dissipating heat from processors, circuit boards, and various other components. The unit is designed to effectively absorb and disperse large amounts of heat, thanks to its large fin area and powerful fan. Additionally, the unit is compatible with both 12V DC and 3-pin fan connectors, allowing it to be used in a wide range of applications. With these features and its reliable design, the ATS-16C-21-C2-R0 is the perfect choice for any application which requires a reliable and powerful thermal solution.
The specific data is subject to PDF, and the above content is for reference