ATS-16C-50-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-16C-50-C3-R0-ND

Manufacturer Part#:

ATS-16C-50-C3-R0

Price: $ 3.54
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X15MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-16C-50-C3-R0 datasheetATS-16C-50-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.22182
30 +: $ 3.13467
50 +: $ 2.96050
100 +: $ 2.78630
250 +: $ 2.61218
500 +: $ 2.52510
1000 +: $ 2.26388
Stock 1000Can Ship Immediately
$ 3.54
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 19.22°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is essential to keep electronic components and systems operating at ideal temperatures for optimal performance and reliability. Heat sinks are one of the most popular and widely used components to regulate and dissipate heat from electronic components. The ATS-16C-50-C3-R0 is one such product designed for thermal management and regulating system temperature.

The ATS-16C-50-C3-R0 is designed for commercial and consumer electronics applications where system performance is heavily dependent on preferred temperature levels. Products of the ATS-16C-50-C3-R0 design are available in a variety of sizes and shapes with mounting mechanisms to suit specific requirements. Its design consists of a conductive metal wedge fins providing an efficient surface area for heat dissipation.

The unique structural features of the ATS-16C-50-C3-R0 make it an ideal pick for those applications where a high grade of heat transfer is necessary. It features a wide selection of fin geometry and configurations for optimal dissipation capabilities. These fins, along with the integrated heat spreader, ensure a high cooling capacity. The cooling capacity is further boosted by the use of advanced heat pipe technology, which improves the efficiency of the system.

The ATS-16C-50-C3-R0 is built to take on temperatures up to 110°C, allowing it to successfully dissipate heat under harsh conditions. The heat sink is anodized to increase thermal transfer efficiency, allowing for faster heat dissipation. This component also offers a wide variety of mounting styles and accessories offering convenient installation solution, regardless of the system design.

The component is designed to perform under temperatures ranging from -50 to + 200°C. It offers a low voltage operation and includes a built-in thermal interface material. This allows for a lower resistance path between the heat source and the fins, delivering superior thermal performance. Additionally, the ATS-16C-50-C3-R0 offers a range of colors and finishes to enhance the product appeal and fit in with a wide variety of aesthetics.

The ATS-16C-50-C3-R0 is designed to deliver efficient performance regardless of the application. It is built for commercial, industrial and consumer electronics applications where the environment requires fine tuned thermal management. The product integrates a highly efficient thermal transfer process that controls and dissipates heat away from sensitive components, allowing for improved and extended system performance.

ATS-16C-50-C3-R0 can be used in applications such as servers, power supplies, data storage, telecom equipment, computers, automotive electronics, and more. It is also perfect for any application where effective thermal management is mandatory and allows for improved efficiency and life expectancy when used in the right environment.

In conclusion, the ATS-16C-50-C3-R0 is an efficient and reliable thermal management component designed for use in a wide variety of commercial, industrial and consumer electronics applications. It offers superior thermal performance coupled with a low voltage operation for maximum efficiency. It also features an anodized design for improved heat transfer, various mounting methods for convenient installation, and a wide range of colors and finishes. This product provides effective and reliable thermal management regardless of the application, making it a perfect choice for any environment requiring optimal temperatures.

The specific data is subject to PDF, and the above content is for reference

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