ATS-16C-63-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS26958-ND

Manufacturer Part#:

ATS-16C-63-C2-R0

Price: $ 4.39
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X20MM L-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-16C-63-C2-R0 datasheetATS-16C-63-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.99420
10 +: $ 3.88647
25 +: $ 3.67063
50 +: $ 3.45467
100 +: $ 3.23870
250 +: $ 3.02279
500 +: $ 2.80687
1000 +: $ 2.75290
Stock 1000Can Ship Immediately
$ 4.39
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 12.32°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat SinksHeat sinks are devices that take heat away from electronic components in order to keep them from becoming too hot. Heat sinks are made from aluminum or other metals and typically have a base and fins that help to dissipate the heat away from the component. They are often used in computers, appliances, LED lighting, and other electronic equipment. Heat sinks are necessary for efficient operation of these devices, and should be chosen correctly in order to ensure sufficient cooling of the device.The ATS-16C-63-C2-R0 is a highly efficient heat sink designed for high power applications. The sophisticated design enables it to achieve excellent thermal performance with reduced footprint. This heat sink is made of aluminum to offer superior thermal conductivity and is compatible with most common board level thermal interface materials. The ATS-16C-63-C2-R0 features multiple fin arrangements to fit most surface mount packages and board sizes. The aluminum has a rough surface finish to increase the surface area which leads to the enhanced cooling performance.The design of the ATS-16C-63-C2-R0 makes it ideal for applications such as power amplifiers, servers, power supplies, power supply modules, and processors. Its unique design enables easy installation and a secure fit for optimal thermal protection. The design also reduces air turbulence which minimizes the thermal resistance and increases the cooling efficiency. Additionally, the ATS-16C-63-C2-R0 is also highly resistant to vibration which ensures its reliable performance in any environment.The ATS-16C-63-C2-R0 is designed to work on a principle of convection. Convection is the process of transporting heat from a hot surface to a cooler area. The heat is transferred by the motion of warm air molecules, also known as convective flow. When the heat is generated from the heatsink, the hot air molecules move away from the hot surface, and cold air molecules move towards the heatsink to take its place. This creates a continuous cycle of heat transfer resulting in a cooler surface. The more efficient the design of the heatsink, the more conveyance of heat is enabled.The ATS-16C-63-C2-R0 is an excellent example of a heat sink which utilizes this convection principle for efficient cooling. Its advanced design enables it to disperse heat at a much faster rate than traditional heat sinks. Its aluminum construction ensures that it will remain durable and reliable for years to come. The ATS-16C-63-C2-R0 is an excellent option for those who need reliable thermal protection and efficient cooling performance.

The specific data is subject to PDF, and the above content is for reference

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