ATS-16C-90-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-16C-90-C1-R0-ND

Manufacturer Part#:

ATS-16C-90-C1-R0

Price: $ 3.94
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X35MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-16C-90-C1-R0 datasheetATS-16C-90-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.58596
30 +: $ 3.38646
50 +: $ 3.18730
100 +: $ 2.98809
250 +: $ 2.78888
500 +: $ 2.58968
1000 +: $ 2.53987
Stock 1000Can Ship Immediately
$ 3.94
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 6.33°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-16C-90-C1-R0 thermal-heat sink is a device that helps to dissipate heat from a variety of electronic components. It operates by controlling the temperature of an electronic device, preventing it from overheating and thus, preventing damage.

The device itself is comprised of a metal base and fins radiating out from the base. This allows for efficient radiative cooling, which dissipates the heat energy from the component or components that the device is attached to. The fin design also allows for forced convection cooling, where the fins act like a fan, drawing in the air to further facilitate heat dissipation.

The ATS-16C-90-C1-R0 heat sink is most commonly used in the electronic or telecommunication industry for power distribution, UPS systems, and PDU systems, such as those used in computers and servers. It is also used in HVAC systems, in medical and military applications, and in the automotive industry for exhaust and emission controls.

Its unique design allows for efficient heat dissipation without the use of a fan, making it one of the most reliable and cost-effective solutions for controlling temperatures in many different applications. This makes the ATS-16C-90-C1-R0 heat sink a great choice for those looking to keep their electronic components and systems in peak operational condition.

The ATS-16C-90-C1-R0 heat sink works by absorbing the heat from a component or components, and then dissipating it into the surrounding environment, thus cooling the component or components. There are two main components to the ATS-16C-90-C1-R0 heat sink – the base and the fins. The base is typically made from aluminum or copper, though other materials can be used as well. It serves as a heat spreader of sorts, allowing for efficient heat transfer to the fins. The fins are also made from metal, but with a much higher thermal conductivity, so that the heat dissipated from them is more quickly absorbed into the surrounding environment.

The use of a heat sink is based on the principle of thermodynamics. Essentially, when two objects of different temperatures come into contact, heat energy is transferred from the warmer object to the cooler one. In a system containing a heat sink, the hotter components transfer the energy into the heat sink, which in turn disperses it into the environment. The resulting cooling of the component or components makes it possible to keep them operating within their specified temperature ranges.

The ATS-16C-90-C1-R0 thermal-heat sink is one of the most popular and cost-effective solutions for controlling the temperature of a variety of electronic components and systems. Its design allows for efficient radiative and convective heat dissipation, and its aluminum or copper base and fins make it an ideal choice for those in the electronic, telecommunication, HVAC, medical, military, and automotive industries.

The specific data is subject to PDF, and the above content is for reference

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