| Allicdata Part #: | ATS-16D-02-C1-R0-ND |
| Manufacturer Part#: |
ATS-16D-02-C1-R0 |
| Price: | $ 3.20 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-16D-02-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.91249 |
| 30 +: | $ 2.83395 |
| 50 +: | $ 2.67649 |
| 100 +: | $ 2.51899 |
| 250 +: | $ 2.36157 |
| 500 +: | $ 2.28284 |
| 1000 +: | $ 2.04668 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-16D-02-C1 is a high performance thermoelectric heat sink that is surprisingly compact in design. This particular heat sink utilizes a Heat Transfer Mobile Framework (HTMF) to provide superior thermal management in an interconnected system that can be efficiently managed by any number of user\'s environmental conditions. The HTMF technology capitalizes on the properties of turbulent air movement by driving the air column over the surface of the sink in an optimal manner for dissipating heat are an even and controllable rate. The persistent air flow in this model also creates a low noise environment that will not interfere with other electronics or processes in the immediate vicinity.
This ATS-16D-02-C1 operates under the Peltier effect, or thermoelectric cooling, to provide superior thermal efficiency as well as improved performance. The Peltier effect is based on the concept of thermoelectricity, which occurs when two dissimilar materials, either metal or semiconductor, are coupled together and a DC current is allowed to pass between them. When this happens, heat is generated on one side and absorbed on the other creating a cooling effect. As the Peltier plate inside the ATS-16D-02-C1 becomes hotter, it drives the air over its surface and creates an efficient cooling system.
This ATS-16D-02-C1 features a unique aluminum fin array design that provides superior heat dissipation without requiring excessive airflow. This efficient design also provides superior water resistance and can be used in moist or humid environments with no worries of rusting or corrosion. Additionally, the air tight design featured on this heat sink also improves thermal transfer as well as providing necessary structural rigidity.
The ATS-16D-02-C1 is an ideal solution for anyone looking for a cost effective and efficient heat sink solution. The HTMF technology provides superior air management, keeping noise to a minimum without adversely affecting airflow across the heat sink. The combination of Peltier effect along with an efficient aluminum fin array ensures temperatures remain stable and reliable for optimum performance. Any user looking for the perfect balance of heat transfer and silence will love the features of the ATS-16D-02-C1.
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